Conference


Conference

ICDV

RVC WON THE BEST PAPER AWARD @ ICDV 2017
*Integrated Circuits, Design and Verification

It was a good news that RVC’s paper for ICDV (Integrated Circuits, Design and Verification) was accepted on September 12, 2017. Last Thursday on October 5th, 2017, ICDV conference was held at Hanoi National University – 144 Xuan Thuy Street, Cau Giay District, Hanoi Capital, Viet Nam.

Mr. Kha Huynh (Hardware Division) and Mr. Kenichi Iwata (Hardware Division) represented the paper at the conference. Technical program consists of 5 technical sessions and 30 presentations, including 2 Keynotes.

There were 45 submissions and 19 papers that were accepted (acceptance ratio was 42%). In the conference, 70 attendees had a lively discussion about integration circuits design and verification.
Mr. Kha Huynh presented our paper entitled ‘16.8 GB/S LPDDR4-3200 @ 32-Bit Memory Access Bandwidth’. This paper won the Best Paper Award.


In Q&A session, there was a difficult question from one audience. Mr. Kha Huynh confidently responded to the question and satisfied the audience with the answer.

Besides, our President – Mr. Atsuo Hanami presented the Keynote speech [Renesas Design Vietnam –Way to a Semiconductor Solution Provider for the next decade from the first Successful decade in Semiconductor Industry of Vietnam]

That was a great opportunity to discuss other engineers/researchers from outside of RVC to understand our position and to know technical trends in the semiconductor field.
After the trip, Mr. Kha Huynh will come back to encourage other engineers to submit technical papers continuously.

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