topics


Renesas Extends Arm Cortex-Based MCU Family with RA4M3 MCU Group for Industrial and IoT Applications

Renesas Extends Arm Cortex-Based MCU Family with RA4M3 MCU Group for Industrial and IoT Applications

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today expanded its RA4 Series microcontrollers (MCUs) with the new 32-bit RA4M3 Group of MCUs. The RA4M3 MCUs boost operating performance up to 100 MHz using the Arm® Cortex®-M33 core based on Armv8-M architecture. Featuring industry-leading performance, Arm TrustZone® technology, Renesas’ Secure Crypto Engine, and a suite of new memory enhancements, the RA4M3 Group makes it easy to develop safe and secure IoT edge devices for low-power applications, such as security, metering, industrial, and HVAC applications.

The RA4M3 Group is designed for low-power IoT applications that require a balance of high performance, strong security, and higher memory. The RA4M3 MCUs combine TrustZone technology with Renesas’ enhanced Secure Crypto Engine, enabling customers to realize secure element functionality in a wide variety of IoT designs. The Secure Crypto Engine incorporates multiple symmetric and asymmetric cryptography accelerators, advanced key management, security lifecycle management, power analysis resistance, and tamper detection.

The RA4M3 MCUs drive power consumption down to 119uA/MHz in active mode running CoreMark from flash memory and 1.6mA in standby mode with standby wakeup times as fast as 30 µs – a critical element for IoT applications operating in the field for extended periods. For memory-intense applications, designers can combine Quad-SPI and SD-card interfaces with the MCUs’ built-in embedded memory to increase capacity. The background operation and Flash Bank SWAP option is ideal for memory optimized firmware updates running in the background. The increased embedded RAM with parity/ECC also makes the RA4M3 MCUs ideal for safety-critical applications. The RA4M3 MCUs also feature several integrated features to lower BOM costs, including capacitive touch sensing, embedded flash memory densities up to 1 MB, and analog, communications, and memory peripherals.
For further info, please access the link via: