topics 2019
2019
Topics 2019
2019.12.17 Renesas Electronics Collaborates with Xilinx on Versal ACAP Reference Designs
TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that its power solutions, as well as timing solutions from IDT, a wholly-owned subsidiary of Renesas, support the Xilinx Versal adaptive compute acceleration platform (ACAP) devices featured on the Xilinx VCK190 evaluation kit and the Renesas VERSALDEMO1Z power reference board. Built on 7nm process technology, Versal is the industry’s first ACAP platform that addresses the needs of a wide range of applications in data center, automotive, 5G wireless, and wired and defense markets.
“We are thrilled to continue our collaboration with Xilinx by providing turn-key clocking and power reference boards that help system developers jumpstart their Versal ACAP designs,” said DK Singh, Director, Systems and Solutions Team at Renesas. “Our industry-leading power and timing solutions provide one-stop solutions to meet all of Versal’s design requirements, allowing customers to design new products with confidence and extra margin.”
“Our Versal ACAP customers are developing highly complex, compute-intensive systems that demand flexible and high-performance power delivery and timing,” said Sumit Shah, senior director, Product Line Marketing and Management at Xilinx. “Through our collaboration with Renesas we’re able to provide customers with pre-validated reference designs that allow them to rapidly develop applications for optimal system performance and power efficiency.”
The Xilinx VCK190 is the first Versal AI Core series evaluation kit. It’s based on the VC1902 Versal AI Core series ACAP, providing the portfolio’s highest AI inference and signal processing throughput for cloud, network, and edge applications. The kit features complete timing solutions including the 8A34001 ClockMatrix™ system synchronizer for IEEE1588 and eCPRI applications, 8T49N240/41 Universal Frequency Translators™ for low-jitter and flexible transceiver SerDes clocking, along with a programmable clock generator and clock buffer/multiplexer for PCIe interface. IDT’s broad portfolio of industry-leading timing solutions can meet all Versal timing requirements with ultra-low phase noise to ensure robust, high-performance product designs.
The Renesas VERSALDEMO1Z power reference board provides full power rails for the Versal ACAP’s adaptable engines, AI engines, scalar engines, and external DDR memory. The board is a complete power supply solution featuring one member of the innovative ISL68xxx digital multiphase PWM controller family and multiple members of the ISL99xxx smart power stage family to provide high-efficiency and scalable Vcore power. Also included are the ISL91211A power management IC (PMIC) and DC-DC regulators to provide an integrated and optimized solution for the rest of the power tree.
Additional Renesas product solutions for the Xilinx Versal platform can be found at www.renesas.com/solutions/key-technology/fpga-power-solutions/xilinx-versal-acap-power-timing.html.
For full article, please follow the link : https://www.renesas.com/sg/en/about/press-center/news/2019/news20191217.html
pagetop2019.12.12 Renesas Electronics Announces World’s Smallest Photocouplers for Industrial Automation and Solar Inverter Applications
TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced five new 8.2mm creepage photocouplers that are the world’s smallest isolation devices for industrial automation equipment and solar inverters. With a package width of 2.5mm, the RV1S92xxA and RV1S22xxA photocouplers reduce PCB mounting area by 35 percent compared to competitive couplers. They help designers shrink equipment size, increase robot axes, and improve factory floor productivity. They also meet the needs of the zero-energy house that requires smaller solar equipment for more installations in limited space. The RV1S92xxA and RV1S22xxA photocouplers are ideal for DC to AC power inverters, AC servo motors, programmable logic controllers (PLCs), robotic arms, solar inverters, and battery storage and charging systems.
The RV1S9260A 15 Mbps communications coupler and RV1S9213A intelligent power module (IPM) driver are the first photocouplers to use tiny LSSO5 packages with a 0.65mm pin pitch, half the pitch of conventional packages. With a package height of 2.1mm, the photocouplers can be directly mounted on the backside of a PCB, freeing up valuable space for topside mounted components. Three times infrared reflow soldering provides maximum flexibility. The RV1S92xxA photocouplers’ electric isolation and high CMR noise rejection (50 kV/µs) protects low voltage microcontrollers and I/O devices from high voltage circuits when transferring high-speed signals.
The RV1S2281A and RV1S2211A are DC input and low DC input, transistor output photocouplers, and the RV1S2285A is an AC input, transistor output coupler. The RV1S22xxA devices also provide 8.2mm creepage distance, 2.5mm package width and 2.1mm package height. They come in LSSOP packages with a 1.30mm pin pitch. All five photocouplers deliver 5000 Vrms reinforced isolation and high temperature operation to withstand harsh operating environments. The RV1S92xxA and RV1S22xxA photocouplers support 200V and 400V systems with reinforced insulation to meet industrial safety standards. All five devices adhere to the strict UL61800-5-1 standard for motor drive equipment, and the UL61010-2-201 standard for control devices such as PLCs.
“The RV1S92xxA and RV1S22xxA photocouplers give designers a variety of functions and the layout flexibility to significantly reduce equipment size and maximize factory floorspace,” said Philip Chesley, Vice President, Industrial Analog and Power Business Division at Renesas. “Our isolation devices also meet the stringent safety requirements of the UL61800-5-1 and UL61010-2-201 standards, enabling manufacturers to design a new generation of high voltage systems for their smart factories.”
For full article, please follow the link : https://www.renesas.com/sg/en/about/press-center/news/2019/news20191212.html
pagetop2019.12.11 Renesas and MinebeaMitsumi Collaborate on Development of Stepping Motor Solutions for Robots, OA Equipment, and Medical/Nursing Equipment
TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and MINEBEA MITSUMI Inc. (MinebeaMitsumi, TSE: 6479), the world’s leading supplier of stepping motors (Note 1), today announced the joint development of resolver-based (angle sensor) stepping motor and motor control solutions optimized for use in robots, office automation (OA) equipment, and medical/nursing care equipment. These applications require motors with higher precision motor control, miniaturized form factors, and improved resistance to environmental influences. Working in collaboration, Renesas and MinebeaMitsumi have developed resolver sensor-based stepping motors and motor control solutions that address these application requirements.
MinebeaMitsumi has a strong track record with resolver sensors for automotive applications and, for the first time, has developed a new resolver for stepping motors to be used in consumer and industrial equipment applications such as robots, OA equipment, and medical/nursing care equipment. As the global 32-bit microcontroller (MCU) market leader (Note 2), Renesas has developed a new resolver-to-digital converter (RDC) that supports MinebeaMitsumi’s new stepping motors, as well as control driver software for controlling the RDC with a 32-bit RX MCU. Renesas also provides a resolver-based stepping motor control kit, which includes development tools, including MinebeaMitsumi’s stepping motor with resolver and an evaluation board with RDC, allowing users to jump-start application development.
“I am extremely pleased that we were able to develop superb products with the cooperation of Renesas, which provides superlative control technologies,” said Katsutoshi Suzuki, Technical Officer, Deputy Officer in charge of Electronics Engineering Development Div. at Engineering Headquarters at MinebeaMitsumi. “I am hoping that this advance in product differentiation for our resolver stepping motors will allow us to acquire new markets.”
“Our cooperative effort with MinebeaMitsumi will allow stepping motors to be used in a wider range of applications,” said Roger Wendelken, Senior Vice President and Head of the Broad-based MCU Business Division, IoT and Infrastructure Business Unit at Renesas. “Our joint collaboration offers customers a solution with everything needed for resolver stepping motor development, including motors, RDCs, MCUs, software and tools, enabling them to accelerate their motor development and shorten their time-to-market.”
For full article, please follow the link : https://www.renesas.com/sg/en/about/press-center/news/2019/news20191211.html#note1
pagetop2019.12.5 Renesas Electronics Introduces Low-Power RL78 Prototyping Board to Simplify IoT Endpoint Equipment Prototyping
TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today launched the RL78/G14 Fast Prototyping Board – a low-cost, function-rich board to enable rapid product development for IoT endpoint equipment. Quicker development prototyping and lower costs give users the agility to respond to rapid changes in technology and market needs, and reduces the time to market window for new products. Renesas also introduced the RL78/G1D BLE Module Expansion Board, which users can combine with the new prototyping board to add Bluetooth® Low Energy wireless communication functions (Note 1) with ease.
The new prototyping board is based on the RL78/G14 microcontroller (MCU), which provides the richest set of functions in the low-power RL78 Family, making it well suited for motor control in portable equipment and IoT sensors, as well as a wide range of IoT endpoint equipment, such as home appliances, industrial equipment, building automation, and health care equipment.
“The rate of IoT equipment evolution is increasing and the ability to realize and prototype new ideas has become a critical point for business success or failure,” said Noriaki Nakanishi, Vice President of the MCU Device Solution Business Division, IoT & Infrastructure Business Unit at Renesas Electronics. “The new prototyping board will allow our customers to jump-start development, and will contribute to timely market entry of new products and customers’ business success.”
For full article, please follow the link : https://www.renesas.com/sg/en/about/press-center/news/2019/news20191205.html
pagetop2019.12.4 Renesas Electronics Delivers Enhanced Security and Privacy for Bluetooth® 5 Connections With 32-Bit RX23W Microcontroller
TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RX23W – a 32-bit microcontroller (MCU) featuring Bluetooth® 5.0 for IoT endpoint devices such as home appliances and healthcare equipment. By combining Bluetooth 5.0 with Renesas’ Trusted Secure IP on its popular high-performance RX MCU family, Renesas offers customers an optimized single-chip solution for system control and wireless communication, while also providing a more secure way to answer the Bluetooth security risks such as eavesdropping, tampering, and viruses.
“While devices with Bluetooth 5.0 Low Energy is not new in the market, Renesas adds value for this ubiquitous wireless technology with a twist: strong emphasis on security and privacy,” said Daryl Khoo, Vice President, Product Marketing, IoT Platform Business Unit at Renesas Electronics Corporation. “The recent security concerns clearly shows that the Bluetooth implementations are getting more complex as more core use cases are defined, and there is a strong need to address better, more secure connections. Renesas believes applications deploying Bluetooth 5.0 Low Energy capabilities will be complemented with our strength in hardware security, all within one MCU that can handle application, communication and security. I am very pleased that Renesas is well positioned to offer this with our flagship RX family which has a proven track record for reliability and safety.”
The new RX23W is based on Renesas’ RXv2 core (Note 1), which provides outstanding computational performance with improved FPU (Note 2) and DSP functions and operates at a maximum clock frequency of 54 MHz. The RX23W provides full Bluetooth® 5.0 Low Energy support including long-range and mesh networking functions and achieves the industry’s lowest level reception mode peak power consumption at 3.0 mA. Furthermore, it integrates a rich set of peripheral functions that are indispensable for IoT equipment, including security, touch key, USB, and CAN functions. These functions allow the RX23W to implement both system control and Bluetooth wireless functions for IoT endpoint equipment such as home appliances, health care equipment, and sports and fitness equipment on a single chip. In addition, the RX23W’s Bluetooth mesh functions make it optimal for industrial IoT equipment collecting sensor data within a factory or a building.
For full article, please follow the link : https://www.renesas.com/sg/en/about/press-center/news/2019/news20191204.html
pagetop2019.11.21 Renesas’ R-IN32M4-CL3 IC Boosts Next-Generation Ethernet TSN, Linking IT and OT Seamlessly With CC-Link IE TSN
TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the development of the R-IN32M4-CL3 IC for industrial Ethernet (IE) communication. Renesas’ latest industrial network device heralds support for CC-Link IE Time Sensitive Networking (TSN), a communication standard for next-generation Ethernet TSN technology.
As one of the first controllers to support CC-Link IE TSN, the R-IN32M4-CL3 satisfies the strict specifications of less than one-millionth of a second time synchronization accuracy between applications, accelerating TSN support for applications such as AC servos, actuators, and vision sensors which demands high-speed responsive control, as well as remote I/O widely used in network communication. As a result, users are able to implement ultra high-speed and high-precision motion control. Furthermore, TSN enables seamlessly linked interoperation between information technology (IT) networks and operational technology (OT) networks, allowing product models or production volumes to be changed in real time, while also providing flexible support for the manufacture of multiple product types in varying quantities and boosts factory productivity overall.
“High-speed networks for motion control are indispensable in supporting efficient and flexible production while boosting productivity,” said Toshihide Tsuboi, Vice President, Industrial Automation Business Division, IoT and Infrastructure Business Unit, Renesas Electronics Corporation. “We are excited to be part of the first wave spearheading communication ICs with CC-Link IE TSN support and to enable our customers as they begin to implement IoT in their factories now and into the future.”
“As a key player in device technology, Renesas has been an active participant in the CLPA from the standards adoption phase onward”, said Masaki Kawazoe, Director, CC-Link Partner Association. “I am very delighted that Renesas is making use of its industrial Ethernet technology to be among the first to deliver ICs supporting CC-Link IE TSN. I am confident that this will further accelerate the development of CC-Link IE TSN-compatible applications and lead to the increased adoption of IoT in smart factories.”.
In addition to driver software, Renesas will provide the TCP/IP protocol software, CC-Link IE TSN protocol software, and CC-Link IE Field protocol software essential to developers. Tessera Technology, Inc., one of Renesas’ partner vendors, will offer an evaluation board, and Renesas will provide a start-up manual, enabling customers to jump-start industrial application development, incorporating the new technology without delay.
Renesas will demonstrate the R-IN32M4-CL3 at the CC-Link Partner Association booth at SPS (Smart Production Solutions) 2019, November 26-28, 2019, in Nuremberg, Germany, and at IIFES (Innovative Industry Fair for E x E Solutions) 2019, November 27-29, 2019, in Tokyo, Japan.
For full article, please follow the link : https://www.renesas.com/sg/en/about/press-center/news/2019/news20191121.html
pagetop2019.11.20 Renesas Electronics Introduces Industry’s First ASi-5 ASSP for Industrial Automation
TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the ASI4U-V5 ASSP – the industry’s first silicon solution to fully implement the ASi-5 (Actuator Sensor Interface specification version 5) standard for industrial network equipment. ASi-5 offers superior performance and usability over ASi-3, delivering 1.27 ms cycle time, 200m cable length and 96 slaves per segment. The field-proven ASSP delivers an easy-to-use fieldbus integration option for developers working with sensors, actuators, and other industrial equipment requiring easy and cost-efficient fieldbus connectivity.
The new ASI4U-V5 ASSP features a fully verified and field-proven firmware that reduces the complexity associated with ASi-5 implementations, allowing users to minimize design risks. The ASSP is fully backwards compatible with ASi-3 devices while incorporating the shorter cycle times, higher bandwidth resulting from the use of Orthogonal Frequency Division Multiplexing (OFDM), enhanced diagnostics, and state-of-the-art robustness associated with the ASi-5 standard. The ASSP also supports all bus topologies, including line, star, and tree. Users can also take advantage of easy and cost-efficient integration with other industrial protocols such as IO-Link and HART.
“As the digital transformation wave sweeps across industrial factories and production facilities, the ASi-5 interface constitutes the shuttle into digitization for millions of connected industrial endpoints and devices at the edge,” said Niels Trapp, Senior Director of Industrial Automation Business Division at Renesas. “The tight collaboration of Renesas and its ASi-5 development partners proved to be extraordinarily successful, and we are excited to bring the first ASi-5 silicon solution to market and enable faster transmission of larger data quantities and more efficient integration with smart sensors that are becoming an integral part of the Industrial IoT.”
Renesas will demonstrate the new ASSP in Booth 110 (Hall 10.1) at the SPS fair, November 26-28, 2019 in Nuremberg.
For full article, please follow the link : https://www.renesas.com/sg/en/about/press-center/news/2019/news20191120.html
pagetop2019.11.14 Renesas RE Microcontroller Wins 2019 Aspencore’s World Electronic Achievement Award
Shenzhen, China ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that its RE microcontroller (MCU), developed based on Renesas’ proprietary SOTB™ (Silicon-on-Thin-Buried-Oxide) process technology, was selected as a winner of 2019 Aspencore’s World Electronic Achievement Awards in the MCU and interface category. Aspencore’s editors evaluated more than 100 products launched in 2019 from major semiconducter suppliers and selected 10 finalists across 12 electronic component categories before naming the winners.
Renesas’ energy harvesting devices feature the company’s unique and revolutionary SOTB process technology, which allows users to simultaneously achieve low active current and low standby current and high-speed operation at low voltage. The RE01 with its 32-bit CPU core, which was launched on October 31, enables users to implement intelligent functions in equipment powered by low levels of harvested energy through ambient energy such as light, vibration, or fluid flow. These embedded controllers make it possible for applications to perform highly accurate sensing and data judgement by excluding noise from signal data when they are used as biological monitors or outdoor environmental sensing applications. By eliminating the need for battery maintenance in a wide range of applications, these embedded controllers will contribute to the increasingly widespread use of IoT equipment. For more information about the RE microcontroller with SOTB, visit here.
“We’re proud that Aspencore recognized the RE as the industry’s best MCU with this award,” said Tomomitsu Maoka, Senior Vice President of Renesas Electronics Corporation and Chairman of Renesas Electronics China. “The extreme low power feature provided by the SOTB process technology is ideal for use in IoT applications. Through harvesting energy from ambient sources and the combination of sensors and wireless devices, RE will contribute to development of a wide range of applications for IoT.”
The World Electronics Achievement Awards honor companies and individuals who make outstanding contributions to innovation and development in the electronics industry worldwide. For more information about WEAA, visit https://doublesummits.eet-china.com/electronic_en.html
For full article, please follow the link : https://www.renesas.com/sg/en/about/press-center/news/2019/news20191114.html
pagetop2019.11.12 Renesas Electronics Expands RA Microcontroller Ecosystem with Ready to Use Partner Solutions
TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the first 10 ready to use partner solutions that support the Renesas Advanced (RA) microcontroller (MCU) Family of 32-bit Arm® Cortex®-M MCUs. RA MCUs deliver optimized performance and ease of use with the Flexible Software Package (FSP) and partner building block solutions that work out-of-box to address a range of Internet of Things (IoT) endpoint and edge applications.
The RA MCU ecosystem today has more than 30 partners with continuous investments planned. Each partner’s building block solution will be labelled with the RA READY badge and is designed to solve real-world customer problems. Ready to use RA solutions accelerate time to market by providing plug & play options that enable a variety of IoT capabilities like security, connectivity, artificial intelligence (AI), machine learning (ML) and human machine interface (HMI). Because the RA FSP is an open architecture, it allows customers to re-use their legacy code and combine it with software examples from Renesas and ecosystem partners to easily implement complex IoT capabilities.
“Explosive IoT growth has exponentially increased embedded design complexity over the last few years,” said Kaushal Vora, Director of Strategic Partnerships & Global Ecosystem at Renesas Electronics Corporation. “Due to the dynamic nature of IoT devices combined with growing design problems and shrinking project timelines, designers struggle to deliver on-time products with competitive feature sets. Now, more than ever, customers need a flexible platform design approach leveraging pre-developed building blocks that work out of the box.”
“We are excited to work closely with Renesas to bring to market a broad range of ready to use RA MCU solutions that accelerate various aspects of the IoT,” said Rolf Segger, founder of SEGGER. “Our emWin embedded GUI software, emCrypt, emSecure and Flasher Secure security software, embOS RTOS and middleware give designers all the required tools they need to build their products.”
For full article, please follow the link : https://www.renesas.com/sg/en/about/press-center/news/2019/news20191112.html
pagetop2019.11.5 Renesas and Altair Semiconductor Announce Collaboration for Cellular IoT Solutions
TOKYO, Japan and HOD HASHARON, Israel ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and Altair Semiconductor (altair-semi.com), a leading provider of cellular IoT chipsets, jointly announced a partnership aimed at bringing ultra-small and ultra-low-power cellular IoT solutions to the global IoT market. Cellular IoT device makers will be able to use this combination of best-in-class solutions to create highly differentiated IoT products and services that offer much greater efficiencies and faster time to market. These integrated solutions will be delivered through Renesas’ sales channels, enabling cellular connectivity to all of its markets.
“We are delighted to collaborate with Altair to deliver the industry’s best cellular IoT solutions to the booming IoT market,” said Sailesh Chittipeddi, Executive Vice President and General Manager of Renesas’ IoT and Infrastructure Business Unit. “Our combined technical excellence and differentiated IP will allow us to design the smallest and lowest power multi-protocol cellular chip-to-cloud solution for Industrial IoT applications desired by our customers for their next-generation products.”
With billions of devices expected to be deployed by 2024, the IoT market demands products that operate seamlessly out of the box. Sensors, cameras, metering, tracking, and smart devices all rely on ultra-low power consumption, offering the potential for a sensor to operate in the field for 10 to 20 years without requiring any hardware maintenance.
“This collaboration makes Altair’s technology accessible to the full breadth of Renesas customers and partners ecosystem,” said Oded Melamed, CEO of Altair Semiconductor. “The Integration of Altair’s differentiated cellular IoT technology with Renesas’ industry-leading MCUs will make this great technology immediately accessible to the mass market of IoT devices and service providers.”
As a first step of this collaboration, Renesas and Altair plan to develop cellular IoT solutions with CAT-M and NB-IoT dual mode chipsets and technologies. They will also design a variety of development tools and software to further streamline the adoption of cellular IoT solutions for industrial and consumer applications. This partnership aims to achieve technical leadership in size reduction, power consumption, and IoT security.
For full article, please follow the link : https://www.renesas.com/sg/en/about/press-center/news/2019/news20191105.html
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