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Renesas Electronics Delivers High-End 3D Graphics for Large-Scale Display Instrument Clusters with R-Car E3 System-On-Chip

TOKYO, Japan ― To address the increasing demand for large-scale digital instrument clusters among all class of vehicles, Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, extends the scalable range of the R-Car family of system-on-chip (SoC) devices with the introduction of the R-Car E3 to realize high-end 3D graphics on the largest class of displays used for automotive instrument clusters – 12.3 inches, 1,920 x 720 pixels. Combining the smooth 3D rendering capabilities with integrated audio DSP and other peripheral functions, the single-chip SoC supports instrument clusters as well as in-vehicle infotainment (IVI) systems with display audio and other capabilities.

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