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Renesas Synergy™ Strengthens Chip-to-Cloud IoT Connectivity with New Enterprise Cloud Toolbox

TOKYO, Japan, February 27, 2018 — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the new Renesas Synergy™ Enterprise Cloud Toolbox v1.1 — a software Application Project that together with the Synergy AE-CLOUD1 kit provides a reference design and starting point for users to connect in 10 minutes or less to enterprise clouds such as Microsoft Azure™, Amazon Web Services™, and Google Cloud Platform™. The Enterprise Cloud Toolbox saves embedded developers weeks or even months to create a secure end-to-end Internet of Things (IoT) application for monitoring and controlling the surrounding environment in home, building, or industrial automation systems.

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https://www.renesas.com/en-hq/about/press-center/news/2018/news20180228b.html