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Renesas Electronics Unveils Industry-Leading Fully Encapsulated Dual 30A and Single 33A Digital Power Modules
Renesas Electronics Unveils Industry-Leading Fully Encapsulated Dual 30A and Single 33A Digital Power Modules
TOKYO, Japan, January 31, 2018 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced two new fully encapsulated digital DC/DC PMBus® power modules that deliver the highest power density and efficiency in their class. The dual ISL8274M operates from a 5V or 12V power rail, provides two 30A outputs and up to 95.5% peak efficiency in a compact 18mm x 23mm2 footprint. The new ZL9024M operates from a 3.3V rail and outputs 33A of power in a 17mm x19mm2 footprint. They deliver point-of-load (POL) conversions for advanced FPGAs, DSPs, ASICs and memory used in servers, telecom, datacom, optical networking and storage equipment. Both devices are easy-to-use, PMBus-configurable power supplies that include a controller, MOSFETs, inductor and passives encapsulated inside a module that increases available board space and reduces bill of materials (BOM).
For further information, please access the link below:
https://www.renesas.com/en-hq/about/press-center/news/2018/news20180131.html