topics 2017
2017
Topics 2017
2017.12.21 Renesas Electronics and Green Hills Software Collaborate on Connected Cockpit Vehicle
TOKYO, Japan and SANTA BARBARA, CA — December 21, 2017 — Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and Green Hills Software, the global leader in high-assurance real-time operating systems and virtualization, today announced their collaboration for the Renesas Connected Cockpit Vehicle developed with a Dodge Ram truck. Stationed in both companies’ areas at CES® 2018, the Dodge Ram 1500 truck includes many new immersive technologies and integrates production-ready automotive-grade hardware, based on the Renesas R-Car H3 automotive computing system-on-chip (SoC), and Green Hills Software’s INTEGRITY® RTOS and INTEGRITY Multivisor™ secure virtualization, and features safe and secure consolidation of ISO 26262-safety critical applications with Android infotainment and cockpit features. The R-Car H3 is part of Renesas’ open, innovative, and trusted Renesas autonomy™ Platform for ADAS and automated driving that delivers total end-to-end solutions scaling from cloud to sensing and vehicle control. With Renesas autonomy, Renesas aims to contribute to a safe and secure society in the autonomous driving era.
For further information, please access the link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171222.html
2017.12.21 Renesas Electronics Accelerates NCAP Front Camera Application Development for Entry and Mid-Range Cars with Comprehensive R-Car V3M-Based Solution
TOKYO, Japan, December 21, 2017 — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the R-Car V3M Starter Kit to simplify and speed up the development of New Car Assessment Program (NCAP, Note 1) front camera applications, surround view systems, and LiDARs. The new starter kit is based on the R-Car V3M image recognition system-on-chip (SoC), delivering a combination of low power consumption and high performance for the growing NCAP front camera market. By combining the R-Car V3M starter kit with supporting software and tools, system developers can easily develop front camera applications, contributing to reduced development efforts and faster time-to-market.
For further information, please access the link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171221b.html
2017.12.21 Renesas Electronics Shifts Production-Ready ADAS, Autonomous, and Cockpit Development Into High Gear at CES 2018
OKYO, Japan, December 21, 2017 ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced automotive semiconductor solutions, today announced the next generation of its advanced driver assistance systems (ADAS), automated driving, and connected cockpit demonstration vehicles. From sensor fusion to ADAS to connected cockpits, the three Renesas vehicles demonstrate fully integrated systems based on advanced, production-ready technologies that enable OEMs and Tier 1s to solve the complex challenges of autonomous vehicle design as the industry shifts from test and simulation to product development. The vehicles are part of Renesas’ open, innovative, and trusted Renesas autonomy™ Platform for ADAS and automated driving that delivers total end-to-end solutions scaling from cloud to sensing and vehicle control. With Renesas autonomy, Renesas aims to contribute to a safe and secure society in the autonomous driving era
For further information, please access the link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171221.html
2017.12.20 Renesas Electronics and Airbiquity Deliver Secure, High-Performance Automotive Solution with Over-the-Air Update Capabilities for Autonomous Driving
SEATTLE, USA and TOKYO, Japan – December 20, 2017 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and Airbiquity®, a global leader in connected vehicle services, today announced a secure, high-performance automotive solution with over-the-air (OTA) capabilities, targeting advanced driver assistance systems (ADAS), vehicle-to-everything (V2X), and automated driving applications of the future.
For further information, please access the link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171220.html
2017.12.19 Intersil to Start Operations as Renesas Electronics America in January 2018
Successful Completion of Integration and New Branding Policy Empower Renesas to Become the World’s Leading Embedded Solution Provider, Expanding its Business with Comprehensive Product Portfolio and Enhanced Customer Services
TOKYO, Japan, December 19, 2017―Renesas Electronics Corporation (TSE:6723, “Renesas”), a premier supplier of advanced semiconductor solutions, today announced the integration of Intersil Corporation as a legal entity and a new branding policy following the acquisition of Intersil on February 24, 2017. Effective January 1, 2018, Intersil Corporation is expected to operate in the market under the name of Renesas Electronics America Inc. The completion of Renesas’ U.S. entity integration marks a major milestone in the integration process, which remains well on track. As well, the integration process in Japan and Korea is expected to be completed on or about January 1, 2018. The remaining Intersil entities are expected to be integrated in the near future.
For further information, please access the link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171219.html
2017.12.14 Renesas Electronics and Dibotics Realize Real-Time, Power-Efficient LiDAR Processing Based on R-Car SoC to Boost Autonomous Driving
TOKYO, Japan, PARIS, France, December 14, 2017 — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, and Dibotics, a pioneer and leader in real-time 3D LiDAR processing, today announced their collaboration to develop an automotive-grade embedded solution for LiDAR processing used in advanced driver assistance systems (ADAS) and automated driving applications. The jointly-developed solution will enable system manufacturers to develop real-time 3D mapping systems with high level functional safety (FuSa) and low-power consumption.
For further information, please access the link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171214.html
2017.12.6 Renesas Electronics Achieves Large-Scale Memory Operation in Fin-Shaped MONOS Flash Memory for Industry’s First High-Performance, Highly Reliable MCUs in 16/14nm Process Nodes and Beyond
TOKYO, Japan, December 6, 2017 ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has successfully confirmed large-scale memory operation in a split-gate metal-oxide nitride oxide silicon (SG-MONOS, Note 1) process using fin-shaped 3D transistors for use in microcontrollers (MCUs) with on-chip flash memory having a circuit linewidth of 16 to 14 nanometer (nm) or finer.
For further information, please access the link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171206.html
2017.12.5 Renesas Electronics and HELLA Aglaia Open Up the Front Camera Market with Open, Scalable ADAS Solution
TOKYO, Japan and Berlin, Germany, December 5, 2017 — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, and HELLA Aglaia, one of the leading global developers of intelligent visual sensor systems, today announced their open and scalable front camera solution for advanced driver assistance systems (ADAS) and automated driving. The new front camera solution combines the R-Car V3M, Renesas’ high-performance, low-power image recognition system-on-chip (SoC) for New Car Assessment Program (NCAP, Note 1), and HELLA Aglaia´s field-proven camera software designed to meet level 2 (partial automation) and level 3 (conditional automation) of the SAE International’s new J3016 standard (Note 2). Designed for scalability, the solution enables system designers to build a wide range of front cameras from cameras supporting NCAP to cameras supporting requirements for up to level 3 applications.
For more detail, please access the link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171205.html
2017.11.30 Mahindra & Renesas Launch Formula E Technical Partnership
Hong Kong, November 30, 2017 ― Mahindra & Mahindra, Ltd. a pioneer in the development of electric vehicles, and Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the formation of a strategic partnership with Renesas as the official technology partner of the Mahindra Racing Formula E team.
For more detail, please access the link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171130.html
2017.11.29 Renesas Electronics Accelerates Industrial Ethernet Application Development with New RZ/N1 Solution Kit
TOKYO, Japan, November 29, 2017 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the availability of the new RZ/N1 microprocessor (MPU) Solution Kit designed to support various industrial network applications including programmable logic controllers (PLCs), intelligent network switches, gateways, operator terminals and remote I/O solutions.
For more detail, please access the link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171129.html