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2019.2.8  Renesas Electronics Reports Full Year 2018 Financial Results

Due to Repercussions of Inventory Buildup in FY17 and Impacts from Weakening End Demands, Full Year Sales Decreased Year-on-Year
FY19 to Generate Early Synergies from IDT Integration and Pursue Continued Thorough Cost and Cash Management in Preparation for the Continuing Weak End Demands in FY19

08 Feb 2019

Q4 2018: Non-GAAP(1) semiconductor sales of 183.8 billion yen, down 11.0% year-on-year. Non-GAAP gross margin of 40.9%, down 7.0 points year-on-year and Non-GAAP operating profits (margin) of 21.2 billion yen (11.3%), down 12.9 billion yen (4.9 points) year-on-year.
Full Year 2018: Non-GAAP semiconductor sales of 740.5 billion yen, down 3.3% year-on-year. Non-GAAP gross margin of 44.7%, down 2.1 points year-on-year and Non-GAAP operating profits (margin) of 110.6 billion yen (14.6%), down 17.5 billion yen (1.8 points) year-on-year.
Outlook for Q1 2019 (IFRS basis): Non-GAAP semiconductor sales within the range of 146.0 billion and 154.0 billion yen. Non-GAAP gross margin of 39%, based on the midpoint of forecasted sales.

TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723, “Renesas”), a premier supplier of advanced semiconductor solutions, today reported the financial results for the fourth quarter ended December 31, 2018 (October 1, 2018 to December 31, 2018) and the financial results for the year ended December 31, 2018 (January 1, 2018 to December 31, 2018).

“In our full year 2018 and fourth quarter, our non-GAAP semiconductor sales decreased by 3.3% year-on-year, and the non-GAAP gross margin decreased by 2.1 points on a year-on-year basis. Our fourth quarter non-GAAP semiconductor sales decreased by 11.0% year-on-year, and non-GAAP gross margin decreased by 7.0 points on a year-on-year basis. Impacts from the weak market conditions as well as our continued efforts to restrain our production volume to achieve optimal inventory levels led to these decreases,” said Bunsei Kure, Representative Director, President and CEO, Renesas Electronics Corporation. “For the first quarter ending March 31, 2019, in light of the continued weak market, we expect semiconductor sales to decrease year-on-year and also foresee a drop in gross margin from a year-ago quarter. With uncertainties for sales in the short term, we will thoroughly control cash and improve operational efficiency and reduce costs through selective concentration of R&D. As for our growth strategy, we will update and announce our mid-term plan after the completion of IDT acquisition.”

For full article, please access link via : https://www.renesas.com/sg/en/about/press-center/news/2019/news20190208a.html

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2019.2.8  Renesas Electronics Announces Consolidated Forecasts for the First Quarter Ending March 31, 2019

08 Feb 2019

TOKYO, Japan ― Renesas Electronics Corporation (“the Group”, TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the consolidated financial forecasts for the three months ending March 31, 2019.

The Group reports its consolidated forecasts on a quarterly basis (cumulative quarters) because of the difficulty of forecasting full-year results with high accuracy due to the short-term volatility of the semiconductor market.

To increase the international comparability of financial information in the capital market as the Group expands its business globally, the Group has decided at the Meeting of the Board of Directors held on November 28, 2018 that it will voluntarily adopt the International Financial Reporting Standards (“IFRS”) to its consolidated financial statements starting from the annual securities report for the fiscal year ending December 31, 2018.

Further, starting from the consolidated forecasts for the three months ending March 31, 2019, the Group will present its financial forecasts as a range. Additionally, in order to provide useful information that will help to better understand the Group’s constant business results, figures such as sales, semiconductor sales and gross margin will be presented in the non-GAAP format, which excludes or adjusts the non-recurring items related to acquisitions and other adjustments removed as non-recurring expenses or income. It should be noted that the gross margin and operating margin forecasts are given assuming the midpoint in the net sales forecast.

For full article, please access link via : https://www.renesas.com/sg/en/about/press-center/news/2019/news20190208b.html

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2019.1.31  Renesas Electronics Expands RX24T and RX24U Microcontroller Lineup for High-Temperature-Tolerant Motor Control Applications

TOKYO, Japan ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the expansion of its RX24T and RX24U Groups of 32-bit microcontrollers (MCUs) to include new high-temperature-tolerant models for motor-control applications that require an expanded operating temperature range. The new RX24T G Version and RX24U G Version support operating temperatures ranging from −40°C to +105°C, while maintaining the high speed, high functionality, and energy efficiency of the RX24T and RX24U MCUs.

“Through the IoT, home appliances and industrial machinery are attaining greater functionality based on network connectivity and user interface enhancements and effective use of the limited interior space as well as the higher temperature environments are becoming major issues,” said Akira Denda, Vice President of Renesas’ Industrial Automation Business Division, Industrial Solution Business Unit. “The newest members of the RX24T and RX24U Groups provide the excellent function and performance that RX users have come to expect from their MCUs while addressing the heat tolerance requirements to support safe and flexible equipment design.”

As device form factors shrink, the heat challenge is growing for motor-control applications. In industrial machinery and office equipment, as well as home appliances that handle hot air and heated water, circuit boards are increasingly being mounted in high-temperature locations. In the case of home appliances such as dishwashers or induction hotplates in particular, demand for designs with larger interior capacity or heating areas is increasing, which restricts the space available for circuit boards. The resulting shift toward circuit board design with a smaller surface area addresses the space constraints but also reduces the board’s capacity to disperse heat, causing the circuit board itself to become quite hot. To address these application needs, Renesas is adding new high-temperature-tolerant products to its MCU lineup that can operate in high-temperature spaces and on hot circuit boards. The new devices will provide greater flexibility for designers of products that operate in high-temperature environments, enabling the trend toward more compact devices to advance.

Software can be developed using the RX24T and RX24U CPU cards combined with the 24 V Motor Control Evaluation Kit which enables developers to create motor control applications in less time.

For full article, please access link via : https://www.renesas.com/sg/en/about/press-center/news/2019/news20190131.html

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2019.1.29  Renesas Electronics Launches Digital Isolators with Superior Radiation Performance for Small Satellites in Low Earth Orbit

TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced two plastic packaged, radiation-tolerant digital isolators that provide the highest isolation protection (2,500VRMS) from high voltage spikes in power supply stages and serial communications interfaces used in low Earth orbit (LEO) Small Satellites (SmallSats). Private “New Space” companies plan to launch thousands of SmallSats forming large constellations that operate in multiple LEO planes. SmallSat mega-constellations provide ubiquitous broadband Internet of Things (IoT) communications anywhere across the globe, and Earth observation high-resolution imaging for sea, air, and land asset tracking.

The passive input ISL71610M and active input ISL71710M offer superior performance across key electrical specifications, including isolation voltage, data rate, common mode transient immunity, propagation delay, quiescent current, and dynamic current. Renesas’ Giant Magneto Resistive (GMR) digital isolators are ideal replacements for optocouplers that are susceptible to cloudy optics from total ionizing dose (TID) radiation. Both GMR isolators also out-perform transformer-based digital isolators that experience electromagnetic interference (EMI) due to radiated emissions from edge and dipole radiation. The Renesas GMR digital isolators are characterization tested at a total ionizing doze (TID) of up to 30krads(Si), and for single event effects (SEE) at a linear energy transfer (LET) of 43MeV•cm2/mg.

In isolation partitioned power supply designs, the ISL71610M and ISL71710M provide an instantaneous 2.5kVRMS of isolation and 600VRMS continuous working voltage at 85°C. In serial communications subsystems that need the transmitter and receiver electrically isolated from each other, the ISL71610M operates up to 100 Mbps, and the ISL71710M up to 150 Mbps. Both offer the New Space industry’s highest data rates–6x higher than competitive solutions–which make them ideal for serial communications links, such as RS-422, RS-485, and Controller Area Network (CAN). The ISL71610M and ISL71710M both have significantly lower quiescent current than the competition, and the ISL71710M has nearly 4x lower dynamic current than Class V isolators.

“The ISL71610M and ISL71710M use a GMR inductive structure that is inherently immune to radiation effects, and build on Renesas’ six decades of spaceflight experience,” said Philip Chesley, Vice President, Industrial Analog and Power Business Division, Renesas Electronics Corporation. “GMR makes our space-grade digital isolators more desirable than optical-based designs, and Renesas’ radiation-tolerant plastic flow provides the optimal cost versus radiation performance in comparison to Class V isolators.”

For full article, please access link via : https://www.renesas.com/sg/en/about/press-center/news/2019/news20190129.html

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2019.1.21  Renesas Electronics Simplifies Home Appliance Maintenance with Failure Detection e-AI Solution for Motor-Equipped Home Appliances

TOKYO, Japan ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the launch of its Failure Detection e-AI Solution for motor-equipped home appliances, featuring the Renesas RX66T 32-bit microcontroller (MCU). This solution with embedded AI (e-AI) enables failure detection of home appliances — such as refrigerators, air conditioners, and washing machines — due to motor abnormality. Property data showing the motor’s current or rotation rate status can be used directly for abnormality detection, making it possible to implement both motor control and e-AI–based abnormality detection with a single MCU. Using the RX66T eliminates the need for additional sensors, thereby reducing a customer’s bill of materials (BOM) cost.

For full article, please access link via : https://www.renesas.com/sg/en/about/press-center/news/2019/news20190121.html

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2019.1.18  Renesas Electronics Proud to be Official Technical Partner of the Victorious Mahindra Racing at Marrakesh E-Prix

TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, congratulates Mahindra Racing on a great performance at the Moroccan track last Saturday for the second round of the 2018/19 ABB FIA Formula E Championship. Team driver Jerome D’Ambrosio took a stunning win, after starting from tenth, and now leads the driver’s championship. After qualifying in a strong seventh on his Formula E debut, fellow team driver Pascal Wehrlein was forced out of the race after being hit on the first lap.

For this season, Renesas has expanded its strategic technology partnership with Mahindra Racing, one of the ten founding teams competing in Formula E. Renesas took a module-level approach to the proof of concept design, developing an electronic control unit including PCB design, schematics, software, and modular-level testing. The upgrades now deliver significant processing power improvements and an improved safety system for the low-voltage battery.

The team continues to collaborate on system-level design upgrades featuring the Renesas RH850/E2x microcontroller (MCU), designed for the robust requirements of powertrain systems, and Renesas’ automotive battery management ICs.

For full article, please access link via : https://www.renesas.com/sg/en/about/press-center/news/2019/news20190118.html

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