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2019.3.30  Renesas Completes Acquisition of Integrated Device Technology

30 Mar 2019

TOKYO, Japan, March 30, 2019 JST | San Jose, California, U.S.A., March 29, 2019 PST― Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

Together with IDT, Renesas will now deliver an even broader range of leading-edge technology and embedded solutions by combining IDT’s RF, high-performance timing, memory interface, real-time interconnect, optical interconnect, wireless power and smart sensors with Renesas microcontrollers, system-on-chips and power management ICs. This combined portfolio enables the creation of new classes of products and solutions in fast-growing, data-economy applications across different verticals, including industrial, infrastructure and automotive segments, for customers and partners across the globe.

To immediately showcase how Renesas and IDT’s complementary product portfolios work together to deliver comprehensive solutions, Renesas and IDT developed 15 “Winning Combinations,” compelling Renesas-plus-IDT product combinations that capture and highlight the technological advantages Renesas and IDT provide as a combined company. Examples of Winning Combinations include IDT automotive timing plus Renesas R-Car processor solutions for automotive infotainment applications, an IDT gas sensor plus Renesas MCU for IoT building automation air quality control and other Winning Combinations for base station, wireline and server applications. To learn more about the Renesas and IDT Winning Combinations, visit www.renesas.com/solutions/idt.html.

As a result of the completion of the transaction, IDT became a wholly owned subsidiary of Renesas. As of today, Dr. Sailesh Chittipeddi joined Renesas’ executive team as Executive Vice President and will lead IDT as President and CEO. Renesas is committed to a smooth and swift integration of the two companies and continuation of technical support and future product development for IDT’s industry-leading analog mixed-signal products.

As previously announced, Renesas anticipates near- and long-term revenue growth from expanded opportunities, access to fast-growing industries, as well as cost savings from a larger business platform, which will bring innovation and improvements along with an expected positive financial impact in the region of US$250 million in non-GAAP operating income per year on a run-rate basis. Renesas expects the acquisition to be highly accretive to Renesas’ pro-forma non-GAAP gross margin, non-GAAP EPS (earnings per share) and free cash flows immediately after completion, consistent with prior guidance. Renesas completed the transaction using approximately US$6.3 billion (approximately ¥693.0 billion at an exchange rate of 110 yen to the dollar), through a combination of cash on hand and debt financing.

“We are thrilled to welcome some of the industry’s best and brightest talent into our team to steer the future of innovation together,” said Bunsei Kure, Representative Director, President and CEO of Renesas. “This acquisition demonstrates our commitment to bringing more complete solutions to our customers around the globe as we strengthen our leadership position in the high-growth, data-driven economy markets of automotive, industrial/IoT and datacenter/communications infrastructure where our advanced data processing and analog/mixed-signal performance is crucial. We fully expect to continue to significantly outgrow our strategic market segments and drive profitability, allowing us to carry on creating superior value for our customers and shareholders.”

“The product portfolios of Renesas and IDT are highly complementary. The combination allows us to bring more innovative and comprehensive portfolio of products to the market, with a larger global footprint, sales force and distribution network,” said Dr. Sailesh Chittipeddi, Executive Vice President of Renesas and President and CEO of IDT. “The winning combinations of products introduced today represent our commitment to achieving an efficient and speedy integration of the two companies and enabling our customers to get to market faster with best-in-class solutions.”

For full articles, please access link via : https://www.renesas.com/sg/en/about/press-center/news/2019/news20190330.html

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2019.3.26  Renesas Electronics to Release RZ/G Linux Platform Solution Supporting IEC 62443 International Standard for Protection of Industrial Control Systems Against Cyberattacks by EO2019

TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced plans to release a security solution based on the Renesas RZ/G Linux Platform that will reduce the amount of time required for users to obtain certification under IEC 62443-4-2, a new international standard for security technologies used to protect industrial control systems from cyberattacks.

In today’s connected world, robust security measures are essential. Cyberattacks on industrial control systems for infrastructure facilities such as manufacturing plants and power stations pose the risk of serious disruption to people’s lives and to the economy. For this reason, the IEC established the IEC 62443 international security standard covering all layers (operators, system integrators, and equipment suppliers) engaged in the manufacturing of industrial control systems and all players (enterprises and organizations involved in industry and public infrastructure). Within this standard, endpoint devices such as sensors and programmable logic controllers (PLCs) must be certified under IEC 62443-4. The certification process imposes a significant burden on developers. It requires them to interpret the difficult standard, to prepare the software and documentation required for certification, and to execute a procedure that requires specialized expertise.

To help developers overcome these certification challenges, Renesas is developing an industrial security solution that supports IEC 62443-4. Together with deliverables through the activities in Civil Infrastructure Platform (CIP™) Project, the Renesas RZ/G Linux Platform security solution will enable users to reduce the time required for obtaining IEC 62443-4-2 certification by as much as six months.

For full articles, please access link via : https://www.renesas.com/sg/en/about/press-center/news/2019/news20190326.html

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2019.3.21  Renesas Electronics Announces the Winners of its Fifth European MCU Car Rally Held at embedded world 2019 in Nuremberg

Düsseldorf, Germany, March 21, 2019 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions,
today announced the winners of its MCU Car Rally contest for university students, which was held on February 28 at embedded world 2019 in Nuremberg, Germany. 30 teams from universities all over Europe, comprising approximately 150 students and their tutors, participated in the challenge with each team developing a functioning model rally car that included sensors to detect a white line on the track and an RX microcontroller (MCU) from Renesas. The lap times were recorded by a timing system based on the Renesas Synergy™ Platform.
With a time of 02:31.60 minutes for five full laps on the 67m circuit, team Brockenblitz from the Harz University, Germany, is the winner of the Renesas MCU Car Rally 2019. The team not only clearly won this year’s MCU Car Rally, but it also beat the 2018 winner’s time by nearly 7 seconds. Team FasTech from the University of Craiova, Romania, whose car completed five laps in 03:13.62 minutes, came in second. The car built by another Harz University team ‘Rising Dragon’ was third with a time of 03:19.08 minutes. Prizes for the winners included Beats Headphones as well as Fitbits and floating Bluetooth speakers for each team member.

For full articles, please access link via : https://www.renesas.com/sg/en/about/press-center/news/2019/news20190321.html

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2019.3.18  Renesas Electronics Announces Industry-Leading 10A and 15A Fully Encapsulated PMBus Power Modules

TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a pair of new encapsulated hybrid digital DC/DC PMBus™ power modules, the 10-amp ISL8280M and 15-amp ISL8282M. The hybrid digital power modules offer best-in-class power density of 115mA/mm2 in a 12mm x 11mm package, with up to 95 percent peak efficiency. They are complete single-channel, synchronous step-down regulated power supplies that operate over a wide input voltage range of 5V to 16V.

Also announced today are the new ISL8210M and ISL8212M analog power modules, offered in the same pin-to-pin compatible 12mm x 11mm package with 10A and 15A of output current, respectively. The hybrid digital and analog power modules provide point-of-load (POL) conversion for advanced FPGAs, DSPs, ASICs and memory used in servers, storage, optical networking, telecom, and a broad range of space-constrained industrial applications. Each device integrates a PWM controller, MOSFETs, and inductor inside a new thermally optimized, Grid High Density Array (GHDA) encapsulated module. To complete the power supply, designers simply add input and output ceramic capacitors.

The ISL828xM hybrid digital and ISL821xM analog power modules feature integrated LDOs that enable single-supply operation. They leverage Renesas’ patented R4™ high-speed control loop architecture with inherent line voltage feed-forward, providing designers a unique combination of ultra-fast load transient response and high noise immunity. Their proprietary Grid HDA package offers unmatched electrical and thermal performance through a single-layer conductive package substrate that efficiently transfers heat from the module to the system board, and dissipates it without requiring airflow or heatsinks – even under heavy load conditions.

“Our newest power modules expand Renesas’ growing portfolio, adding new capabilities to our performance analog module family and bridging the gap between them and our full digital power modules,” said Philip Chesley, Vice President, Industrial Analog and Power Business Division, Renesas Electronics Corporation. “The new hybrid digital power modules offer class-leading power density and efficiency not achievable with discrete components. Compared to competitors’ module designs, the new Grid HDA package makes it easier for customers to mount the module on their circuit board.”

For full articles, please access link via : https://www.renesas.com/sg/en/about/press-center/news/2019/news20190318.html

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2019.3.11  Renesas Electronics Showcases Intelligent Power Solutions at APEC 2019

MILPITAS, Calif. – As markets become more energy conscious and connected within the Internet of Things (IoT), designing for power becomes more challenging. Today, Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced it will showcase its growing portfolio of intelligent, secure, and cloud-connected power solutions in booth #347 at the Applied Power Electronics Conference (APEC), in Anaheim, Calif., March 18-20, 2019.

At APEC, Renesas will highlight state-of-the-art solutions and techniques that address evolving power management, performance, and time-to-market needs for several industries, including industrial, IoT cloud infrastructure and endpoint devices, home appliances, and small satellite mega-constellations.

For further info, please access link via : https://www.renesas.com/sg/en/about/press-center/news/2019/news20190311.html

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2019.3.7  Renesas Electronics Introduces RX Functional Safety Solution with World’s First SIL3 Software Certification for Industrial Equipment

TOKYO, Japan ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced “RX Functional Safety”, a new solution for industrial applications that reduces the complexity of IEC 61508 SIL3 (Note 1) certification, an international standard for functional safety. Based on the RX family of microcontrollers (MCUs), the new solution provides advanced functional safety for industrial equipment, including functions for chip self-diagnostics, the world’s first (Note 2) SIL3-certified functional safety software and reference documents for users to develop the safety part of industrial applications. The complete functional safety support for industrial applications allows users to shorten the certification acquisition process by a year or more.

Featuring a dual-MCU configuration, RX Functional Safety will support all Renesas MCUs based on the RXv2 core to enable simple safety verification and a highly efficient diagnostics software. With the SIL3-certified software, the solution eliminates the need for users to develop functional safety software dependant to Renesas MCUs and allows them to focus on development of software for their own application components.

For full articles, please access link via : https://www.renesas.com/sg/en/about/press-center/news/2019/news20190307.html

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