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2018.10.31  Renesas Electronics Announces Absorption-Type Merger (Simplified Merger) with Consolidated Subsidiary

TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723, “Renesas”), a premier supplier of advanced semiconductor solutions, today announced that it has resolved at the Meeting of Board of Directors held on October 31, 2018 to consolidate its wholly-owned subsidiary Renesas Semiconductor Package & Test Solutions Co., Ltd. (“Renesas Semiconductor Package & Test Solutions”) through an absorption-type merger (“Merger”). Certain disclosure items and details have been omitted due to the Merger being an absorption-type merger of a wholly-owned subsidiary.

For full article, please access the link as : https://www.renesas.com/sg/en/about/press-center/news/2018/news20181031c.html

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2018.10.29  Renesas Electronics RX65N Microcontrollers Support DDS-XRCE Communication Protocol for ROS 2

TOKYO, Japan ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, is accelerating the development of robotics systems to deliver intelligence at the industrial endpoint by extending the features of Renesas’ high-performance, 32-bit RX65N Series of microcontrollers (MCUs) to support the DDS-XRCE (Data-Distribution Service for Extremely Resource Constrained Environments™), one of the upcoming protocol standards for ROS 2 communication. Renesas’ support of the DDS-XRCE framework enables the development of software that controls the sensors and actuators that will be embedded at robotics system endpoints, such as welfare, safe guard, reception, cleaning, household robots, and other robotics endpoints.

For full article, please access the link : https://www.renesas.com/sg/en/about/press-center/news/2018/news20181029.html

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2018.10.25  Renesas Unveils RXv3 CPU Core with Industry-Leading Performance: Powering Up New 32-Bit RX MCU Families

TOKYO, Japan – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the development of its third-generation 32-bit RX CPU core, the RXv3. The RXv3 CPU core will be employed in Renesas’ new RX microcontroller (MCU) families that begin rolling out at the end of 2018. The new MCUs are designed to address the real-time performance and enhanced stability required by motor control and industrial applications in next-generation smart factory, smart home and smart infrastructure equipment.

The innovative RXv3 core boosts the proven Renesas RX CPU core architecture with up to 5.8 CoreMark®/MHz, as measured by EEMBC® Benchmarks, to deliver industry-leading performance (Note), power efficiency, and responsiveness. The RXv3 core is backwards compatible with the RXv2 and RXv1 CPU cores in Renesas’ current 32-bit RX MCU families. Binary compatibility using the same CPU core instruction sets ensures that applications written for the previous-generation RXv2 and RXv1 cores carry forward to the RXv3-based MCUs. Designers working with RXv3-based MCUs can also take advantage of the robust Renesas RX development ecosystem to develop their embedded systems.

“The cutting-edge RXv3 core technology targets a wide range of embedded applications in the industrial IoT era where ever increasing system complexity places higher demands on performance and power efficiency,” said Daryl Khoo, Vice President Product Marketing, IoT Platform Business Division, Renesas Electronics Corporation. “The EEMBC CoreMark/MHz processor benchmark clearly shows the RXv3 core outperforms all competing CPU cores. Once again, Renesas delivers superior MCU performance and power efficiency to our customers’ next-generation embedded systems.”

For full article, please view the link as : https://www.renesas.com/sg/en/about/press-center/news/2018/news20181025.html

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2018.10.23  Renesas and BlackBerry Deliver R-Car Based Development Environment Integrating Virtualization, Functional Safety, and Security

TOKYO, Japan ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions and BlackBerry Limited (NYSE: BB; TSX: BB), today announced they are expanding their partnership to offer an integrated virtualization, functional safety and secure development environment for the Renesas R-Car system-on-chip (SoC) devices. Using BlackBerry’s QNX software, it was developed as part of the companies’ ongoing strategic relationship to advance autonomous and connected driving technology.

Available today, the new development environment is an expansion of Renesas’ software package lineup for the R-Car automotive computing platform. It allows automotive cockpit system designers to quickly develop advanced cockpit systems and improve the user experience.

The development environment features both the high reliability and rich graphics functions required for integrated cockpit systems. It is based on the Renesas R-Car family, and features BlackBerry’s QNX Software Development Platform 7.0 and QNX Hypervisor 2.0 virtualization software. It also provides access to the extensive set of software products developed by BlackBerry, allowing designers to leverage the multimedia and HMI-related software for cockpit graphics systems development.

For full article, please access link as : https://www.renesas.com/sg/en/about/press-center/news/2018/news20181023.html

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2018.10.19  Renesas Electronics Recognizes BFG Engineering With 2018 Renesas European Alliance Partner of the Year Award

Düsseldorf – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has presented BFG Engineering with its Renesas European Alliance Partner of the Year Award in recognition of the exceptional achievements it made in 2018.

The Renesas Alliance Partner Network includes over one thousand partner companies worldwide who understand Renesas products, and whose specialisations and expertise enable Renesas customers to achieve an edge over their competition and get to market quicker. These partners include independent design houses, complementary component suppliers, manufacturing and programming houses, and hardware, software, cloud, tool and training vendors.

BFG, located in Vicenza, Italy, is a development house focused on hardware and software design, specialising in the advanced control of electric drives, automation of small machinery and control of industrial processes. BFG has completed more than 60 customised designs for Renesas customers during its long-standing relationship. Recent developments include innovative development tools that enable faster than ever design of complex motor control applications based on the Renesas Synergy™ Platform and RX microcontroller families.

Steve Norman, Senior Manager, Customer and Partner Promotion at Renesas Electronics, said: “The focus of this award is outstanding service to our mutual customers, and for many years BFG has delivered this right first time, every time, with incredible attention to detail, customer satisfaction, and a whole lot more. These contributions deserve recognition.”

Please visit URL for full article : https://www.renesas.com/sg/en/about/press-center/news/2018/news20181019.html

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2018.10.17  Renesas Electronics Delivers High-End 3D Graphics for Large-Scale Display Instrument Clusters with R-Car E3 System-On-Chip

TOKYO, Japan ― To address the increasing demand for large-scale digital instrument clusters among all class of vehicles, Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, extends the scalable range of the R-Car family of system-on-chip (SoC) devices with the introduction of the R-Car E3 to realize high-end 3D graphics on the largest class of displays used for automotive instrument clusters – 12.3 inches, 1,920 x 720 pixels. Combining the smooth 3D rendering capabilities with integrated audio DSP and other peripheral functions, the single-chip SoC supports instrument clusters as well as in-vehicle infotainment (IVI) systems with display audio and other capabilities.

To view full article, please visit URL : https://www.renesas.com/sg/en/about/press-center/news/2018/news20181017.html

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