topics 2022


2022

Topics 2022

2022.8.2  Renesas Launches 5V RX660 32-Bit MCUs with Superior Noise Tolerance for Home Appliances and Industrial Applications

First RX Family MCUs with CAN FD Bus Protocol Enable High-Speed Communication for Industrial Equipment and Robotics

August 2, 2022
5V RX660 32-Bit MCUs with Superior Noise Tolerance
TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a new addition to the RX 32-bit MCU Family, the RX660 group of microcontrollers (MCUs) that supports operating voltages of up to 5V, offering superior noise tolerance for home appliances and industrial equipment exposed to high electromagnetic interference. The RX660 is the first in Renesas’ higher-end RX general-purpose MCU devices to support 5V and the first in the RX Family to feature a built-in CAN FD controller that enables fast data communication. The high operating voltages of the new RX660 MCUs eliminate the need for external noise-suppression components that are required for many 3V MCUs today. This allows customer to reduce development time and component cost, improving system quality.

In recent years, the scale of software has grown as functional safety and security have become a critical part of electronic systems. As the number of product models has also increased, more products are equipped with realtime operating systems in order to simplify software maintenance. Additionally, products need to be designed to accommodate future functional enhancements using over-the-air (OTA) updates. To meet these needs, Renesas developed the RX660 using its RXv3 core (6.00 CoreMark/MHz) with a maximum operating frequency of 120 MHz, offering high performance and excellent power efficiency. The devices feature large-capacity ROM of up to 1 megabyte (MB) and RAM of up to 128 kilobytes (KB) and are available in many package options (48-pin to 144-pin). In particular, the effective pin count for general-purpose I/O pins is 10% higher than on the earlier RX210, which is also 5V compatible. For example, the 144-pin version of the RX660 has an effective pin count of 134, 11 more than on the RX210. With this increase in I/O count, more sensors can be connected to an MCU for a given package, making it simpler to upgrade existing systems.

For further information, please click the link : https://www.renesas.com/sg/en/about/press-room/renesas-launches-5v-rx660-32-bit-mcus-superior-noise-tolerance-home-appliances-and-industrial

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2022.7.29  Renesas Announces Appointment of Julie Pope as First Chief Human Resources Officer

July 29, 2022
TOKYO, Japan, July 29, 2022—Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that Julie Pope, now Vice President of Human Resources (HR), has been named Senior Vice President and the company’s first Chief Human Resources Officer (CHRO), effective September 1, 2022.

As SVP and CHRO, Julie will oversee Renesas’ global HR organization, including talent acquisition and management, Renesas Culture promotion, compensation an appointment-julie-pope-first-chief-human-resources-officer-0″>d benefits, diversity, equity & inclusion and HR operations. Under Julie’s leadership, Renesas aims to accelerate its efforts to make it the best place to work for its employees by accelerating the globalization and streamlining of its HR efforts.

Julie joined Renesas in August 2021, following the completion of the acquisition of Dialog Semiconductor Plc, where she served as Senior Vice President of HR. She brings about 30 years of HR experience across several global organizations. Throughout her career, Julie has developed expertise in driving organizational effectiveness and helping to revitalize organizations to enhance profitability and growth.

“Our success starts with our people and our culture,” said Julie Pope, Vice President of Human Resources at Renesas. “As Renesas’ first CHRO, I am delighted to have the opportunity to continue to cultivate an engaging and rewarding workplace for our employees. By building talented, diverse teams and fostering career development, this will enable us to drive sustainable growth in the global semiconductor market.”

For further information, please click the link via : https://www.renesas.com/sg/en/about/press-room/renesas-announces-appointment-julie-pope-first-chief-human-resources-officer-0

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2022.7.26  Renesas Introduces “Renesas Day” and “Focus Fridays” for Global Employees

Special Day-Off and Meeting-Free Days for a Better Work Environment

July 26, 2022
TOKYO, Japan, July 26, 2022 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced new initiatives for improving workplace environment: “Renesas Day” and “Focus Fridays.” These measures will be offered to all global employees throughout August 2022.

Renesas is committed to providing a workplace environment where its talented employees can fully harness their potential while achieving work-life balance. Under this aspiration, Renesas spearheaded workstyle flexibility, such as implementing work-from-home policies and encouraging flexibility in working time.

The new initiatives being introduced are “Renesas Day” where a special day-off will be given on August 12, 2022 to all global employees, and “Focus Fridays” in which employees are encouraged not to book any meetings on Fridays during the month of August.

This is the first time that Renesas has implemented a unified day off or meeting-free days for all global employees. Being able to take a day off or avoid meetings on a single day across the Group will enable employees to not only relax and recharge, but also create time to further focus on their work with less interruption. Renesas aims to bolster employee productivity and engagement through these initiatives.

For further info, kindly assess the link via : https://www.renesas.com/sg/en/about/press-room/renesas-introduces-renesas-day-and-focus-fridays-global-employees

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2022.7.20  Renesas Completes Acquisition of Reality AI

July 20, 2022
TOKYO, Japan, July 20, 2022 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the completion of the acquisition of Reality Analytics, Inc. (Reality AI), a leading provider of embedded AI solutions, as of July 19, 2022, following Reality AI shareholders’ and required regulatory approval.

Headquartered in Columbia, Maryland, U.S., Reality AI offers a wide range of embedded AI and Tiny Machine Learning (TinyML) solutions for advanced non-visual sensing in automotive, industrial and commercial products. Combining Reality AI’s best-in-class AI inference technologies with Renesas’ extensive MCU and MPU product portfolios will enable seamless implementation of machine learning and signal processing. The acquisition will allow Renesas to expand its tool suite and software offerings for AI applications and increase its in-house capability to provide highly optimized endpoint solutions that combine both hardware and software.

Renesas will continue to accelerate the delivery of end-point intelligence in a vast array of IIoT (Industrial IoT), consumer and automotive applications. Renesas’ MCU/MPU platforms with machine-learning algorithms will significantly enhance system development, providing customers with unmatched developer experience to make their applications AIoT (Artificial Intelligence of Things) ready and help them get to market faster.

With the completion of the acquisition, Reality AI has become an indirect wholly owned subsidiary of Renesas. Renesas now possesses Reality AI’s team of AI experts and an AIoT R&D center-of-excellence in Maryland, U.S. As a leading provider of AIoT solutions, Renesas will continue to meet the needs of customers seeking to implement AI solutions with the expanded global talent network of software engineers.

For further information, please assess the link : https://www.renesas.com/sg/en/about/press-room/renesas-completes-acquisition-reality-ai

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2022.6.29  Renesas and Cyberon Partner to Deliver Integrated Voice User Interface Solutions for Renesas RA MCUs Supporting Over 40 Global Languages

Customers to Quickly Add Voice Recognition Technology for Endpoint Applications Within Home Appliances, Building Automation, Industrial Automation and Many More

June 29, 2022
Renesas and Cyberon Partner to Deliver Integrated Voice Interface Solution for RA MCUs
TOKYO, Japan, and Taipei, TAIWAN ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and Cyberon Corporation, a leading embedded speech solution provider, today announced that they have partnered to deliver voice user interface (VUI) solutions for customers using Renesas’ entire RA MCU line. Renesas RA customers will now have complimentary access to Cyberon’s industry-leading continuous command-based VUI toolchain, enabling them to add voice-recognition to a variety of endpoint applications in home appliances, building automation, industrial automation, wearables, and many more.

Voice recognition is growing rapidly worldwide, driven by the explosion of IoT applications and the COVID-19 pandemic. Cyberon’s proven voice-recognition technology has been adopted in millions of devices worldwide.

Renesas is making a Voice Reference Hardware Platform available to enable rapid prototyping and development of voice interfaces. The new hardware platform enables local voice recognition without a network connection using Cyberon’s DSpotter solution. DSpotter’s phoneme-based modelling approach allows quick command customization with only text input, eliminating the need for massive voice data collection and thereby reducing development costs and time. DSpotter supports over 40 global languages, empowering customers to adopt voice technology on embedded applications worldwide. This Voice User Interface (VUI) solution demonstrates how easy it is to control a system with a simple voice command interface without extensive coding experience or in-house expertise.

“Customers in multiple segments are looking for help to quickly add reliable voice user commands to their products,” said Mohammed Dogar, Vice President of Global Business Development and Ecosystem in Renesas’ IoT and Infrastructure Business Unit. “Our partnership with Cyberon gives them access to proven voice technology across our entire line of RA MCUs, from entry-line to full-featured devices.”

Please follow the link for full articles : https://www.renesas.com/sg/en/about/press-room/renesas-and-cyberon-partner-deliver-integrated-voice-user-interface-solutions-renesas-ra-mcus

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2022.6.29  Renesas Partners with Tata to Accelerate Progress in Advanced Electronics for India and Emerging Markets

Strategic Partnership Focuses on Development of Semiconductor Solutions to Drive Leading Technologies Across Automotive, IoT and 5G Systems

June 29, 2022
TOKYO, June 29, 2022 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a strategic partnership with Tata Motors Ltd. (TML) and Tejas Networks Ltd. (Tejas), both Tata Group companies, on the design, development and manufacturing of Renesas’ semiconductor solutions for enhancing innovation across electronics systems for the Indian and emerging markets. These joint endeavors extend the companies’ longstanding relationship as technology and business partners, including the recently announced Next-generation EV Innovation Center (NEVIC) jointly established by Renesas and Tata Group’s Tata Elxsi in March 2022.

The future of automotive systems design lies in a vehicle-centralized, zone-oriented electronic and electrical (E/E) architecture. Renesas and TML will collaborate on developing next-generation automotive electronics to drive leadership performance and scalability for vehicles. Renesas with deep expertise in semiconductor technology will partner with TML to accelerate the development of electric and connected vehicles to further enhance TML’s pre-eminence and market-leading position. To effectively address evolving customers’ aspirations, Renesas and TML will explore a non-exclusive partnership on emerging technologies such as ADAS.

Renesas will collaborate with Tejas for implementing next-generation wireless network solutions. This includes design and development of semiconductor solutions for radio units (RU) used in telecom networks, from 4G, 5G, to open radio access network (O-RAN), which enables open and flexible 5G RAN deployments, in addition to allowing wider interoperability. The companies aim to roll out products and solutions initially for India and aim to expand its footprint in the global markets.

Additionally, Renesas and Tata Consultancy Services Limited (TCS), a company of Tata Group, will partner by establishing a Joint System Solution Development Center in Bangalore. The planned innovation center will focus on comprehensive system solutions for the IoT, Infrastructure, Industrial and Automotive segments by leveraging Renesas’ semiconductor solutions and TCS’ industry experience.

“We see great potential in collaborating with Renesas in areas like automotive electronics and present and future telecom networks. The collaboration will accelerate our presence in these areas in India as well as globally,” said Natarajan Chandrasekaran, Chairman, Tata Sons.

“This partnership brings two industry leading companies closer together, creating numerous benefits,” said Hidetoshi Shibata, President and CEO at Renesas. “Renesas and Tata will support the acceleration of progress in advanced electronics and its multitudes of applications for the Indian and emerging markets, which sets us both on a path for continued success.”

About Renesas Electronics Corporation

Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, Twitter, YouTube, and Instagram.

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2022.6.22  Renesas Delivers Industry’s Most Complete Intelligent Sensor Solutions for IoT Applications

Offers New Sensors and Signal Conditioning ICs Complementing Leading MCU Line, Advanced Firmware, Embedded AI, and Unique Quick-Connect IoT Design Platform

June 22, 2022
Renesas Delivers Industry’s Most Complete Intelligent Sensor Solutions for IoT Applications
TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, is changing the way designers build sensor-connected IoT applications with a range of new solutions targeted at faster design cycles, improved accuracy, and reduced system cost.

In addition to the new HS4XXX family of relative humidity and temperature sensors, Renesas is introducing the ZSSC3281 sensor signal conditioning (SSC) IC for highly accurate amplification, digitization, and sensor-specific correction of sensor signals. These new products complement Renesas’ extensive MCU portfolio and embedded AI solutions.

The sensor design process is supported by Renesas’ unique system design platform that significantly eases the prototyping of IoT systems. The Renesas Quick-Connect IoT system consists of standardized boards and interfaces, enabling designers to quickly and easily connect a wide range of sensors to MCU/MPU development boards. The new system also delivers core software building blocks that are portable between boards, greatly reducing coding requirements. Now, instead of writing and testing hundreds of lines of driver code, designers only need to graphically select their sensor and write a few lines of code. All the integration and setup effort happen behind the scenes, reducing the time to a working solution.

Please follow the link for full article via : https://www.renesas.com/sg/en/about/press-room/renesas-delivers-industry-s-most-complete-intelligent-sensor-solutions-iot-applications

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2022.6.21  Renesas Launches World’s Most Highly Integrated Advanced Bluetooth Low Energy SoC

New SmartBond DA1470x Family Features Small Form Factor with Integrated Applications and 2D Graphics Processors, Voice Activity Detector and Power Management Enables Small Form Factor for IoT Product Designs

June 21, 2022
Renesas DA1470x Highly Integrated Advanced Bluetooth® Low Energy SoC
TOKYO, Japan ―Renesas Electronics Corporation (TSE: 6723) today announced the SmartBond™ DA1470x Family of Bluetooth® low energy (LE) solutions―the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity.

The DA1470x Family is the only solution in the Bluetooth LE space to integrate a power management unit, a hardware voice activity detector (VAD), a Graphics Processing Unit (GPU) and Bluetooth LE connectivity all into a single chip. This combined functionality provides smart IoT devices with the most advanced sensor and graphical capabilities and seamless, ultra-low-power, always-on audio processing. The new family is ideal for wearables like smartwatches and fitness trackers; glucose monitor readers and other consumer medical and healthcare devices; home appliances with displays; industrial automation and security systems; and Bluetooth consoles such as e-bikes and gaming equipment.

“The DA1470x family expands on our successful strategy of integrating more functions, including greater processing power, expanded memory and improved power modules, along with VAD for always-on wake and command word detection,” said Sean McGrath, Vice President of the Connectivity and Audio Business Division in Renesas’ IoT, Industrial and Infrastructure Business Unit. “This feature-packed SoC product family enables developers to push the boundaries of connected consumer and industrial applications and future-proof their IoT products to fit the needs of multiple applications, while optimizing their bill of materials.”

The high level of integration further results in significant cost savings on the Bill of Materials (BoM), enabling cost-effective system solutions. It also reduces component count on the PCB enabling smaller form factor designs and freeing up space for additional components or larger batteries. With less components on the PCB, the reliability of the system is also improved, delivering a further reduction in the total cost of goods sold (COGS) of the end product.

The SmartBondDA1470x Family is already gaining acceptance in the market. For example, the DA14706 is at the heart of the newly launched Xiaomi Mi band 7 with an eye catching 1.62“, 192×490 AMOLED display, 120 sports modes and a 15-day battery life for typical use.

Please follow the link for full article : https://www.renesas.com/sg/en/about/press-room/renesas-launches-world-s-most-highly-integrated-advanced-bluetooth-low-energy-soc

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2022.6.16  Renesas Develops Circuit Technologies for 22-nm Embedded STT-MRAM with Faster Read and Write Performance for MCUs in IoT Applications

Announced at 2022 Symposium on VLSI: Achieving 5.9 ns Random Read Access and 5.8 MB/s Write Throughput on Test Chip

June 16, 2022
Embedded STT-MRAM Test Chip
TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that it has developed circuit technologies for an embedded spin-transfer torque magnetoresistive random-access memory (STT-MRAM, hereinafter MRAM) test chip with fast read and write operations fabricated using a 22-nm process. The test chip includes a 32-megabit (Mbit) embedded MRAM memory cell array and achieves 5.9-nanosecond (ns) random read access at a maximum junction temperature of 150°C, and a write throughput of 5.8-megabyte-per-second (MB/s).

Renesas presented these achievements on June 16 at the 2022 IEEE Symposium on VLSI Technology and Circuits, held between June 12 and 17 in Hawaii.

As the advances of IoT and AI technologies continue, microcontroller units (MCUs) used in endpoint devices are expected to deliver higher performance than ever, and therefore need to be fabricated with finer process nodes. MRAM fabricated in BEOL (Note 1) is advantageous compared to flash memory fabricated in FEOL (Note 2) for sub-22 nm processes because it is compatible with existing CMOS logic process technology and requires fewer additional mask layers. However, MRAM has a smaller read margin than flash memory, which degrades read speed. A large gap between the CPU operating frequency and the read frequency of the non-volatile memory is also a challenge since it can degrade MCU performance.

MRAM can also achieve shorter write time than flash memory because it requires no erase operation before write operation. However, further speed improvements are needed to shorten system downtime for over-the-air (OTA) updates required for endpoint devices and reduce costs for end product manufacturers in writing control codes for MCUs.

Please view full article via link : https://www.renesas.com/sg/en/about/press-room/renesas-develops-circuit-technologies-22-nm-embedded-stt-mram-faster-read-and-write-performance-mcus

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2022.6.15  Renesas Launches Cellular-to-Cloud IoT Development Platforms Powered by RA and RX MCU Families

Renesas Combines its MCUs, Sensors, Analog and Power Devices with Cat-M1 Cellular Module to Enable End-to-End Cloud Connectivity

June 15, 2022
Certified Cellular-to-Cloud IoT Development Kits Simplify Solution Prototyping
TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced two new cloud development kits, CK-RA6M5 and CK-RX65N, providing a complete connectivity solution for the RA and RX Families of 32-bit microcontrollers (MCUs). The cloud kits are the first to be equipped with Renesas’ RYZ014A Cat-M1 module, a certified LTE cellular module that offers the ability to establish wireless connection between MCUs and cloud services quickly and securely without a gateway.

Armed with these cloud kits, users can rapidly develop IoT cloud products and solutions without having to design their own complex circuitry and software stacks. The kits include the RYZ014A Cat-M1 Pmod™ module, multiple sensors, a high-performance MCU, hardware-based security, and a reliable software stack.

The cloud kits are ready to connect to global cloud service providers such as AWS Cloud and IoT services. Both kits are designed to run on AWS (Amazon Web Services) FreeRTOS for CK-RA6M5 using FSP (Flexible Software Package) and CK-RX65N using RDP (RX Driver Package). Once connected to AWS IoT Core, the kits have access to many Cloud and IoT services from AWS for data analytics and IoT device management.

Please follow the link for full article via : https://www.renesas.com/sg/en/about/press-room/renesas-launches-cellular-cloud-iot-development-platforms-powered-ra-and-rx-mcu-families

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