topics 2021


2021

Topics 2021

2021.2.25  Renesas’ Intersil-Brand Radiation-Hardened ICs Onboard the Hayabusa2 Six-Year Asteroid Samples Retrieval Mission

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that its radiation-hardened (rad-hard) integrated circuits (ICs) were onboard the Hayabusa2 spacecraft that returned asteroid samples to Earth in an armored re-entry capsule on December 6, 2020. Operated by the Japan Aerospace Exploration Agency (JAXA), Hayabusa2 launched onboard the H-IIA rocket from the Tanegashima Space Center on December 3, 2014.

Arriving at the Ryugu asteroid on June 27, 2018, the Hayabusa2 asteroid samples retrieval mission was designed to explore the origins of the planets, the water of Earth’s oceans and source of life. Hayabusa2 carried multiple science payloads for remote sensing and sampling, and its four small rovers investigated the asteroid surface and analyzed the environmental and geological context of the surface and subsurface samples collected.

Renesas’ Intersil-brand rad-hard ICs were deployed throughout the Hayabusa2 spacecraft. Renesas’ Intersil-brand rad-hard solutions included a linear regulator, voltage reference, PWM controller, MOSFET drivers, quad comparator, 8-channel and 16-channel multiplexers, and RS-422 receivers & drivers.

For further info, please access the link via: https://www.renesas.com/sg/en/about/press-room/renesas-intersil-brand-radiation-hardened-ics-onboard-hayabusa2-six-year-asteroid-samples-retrieval

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2021.2.24  Renesas and LUPA Accelerate Automotive Smart Camera Development with Open Platform Turnkey Solutions

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and LUPA-Electronics GmbH, an automotive safety solution provider, today announced the EagleCAM module, an open front camera solution, featuring Renesas’ R-Car V3H and R-Car V3M system-on-chip (SoC) devices. The all-in-one scalable camera platform targets the latest Euro NCAP and C-NCAP requirements, such as automatic emergency braking, forward collision warning, lane keeping assist, and traffic sign recognition. The jointly-developed solutions enables OEMs and Tier 1s to differentiate and extend their offering by integrating their proprietary or third-party software that adds additional driving features.

Most smart camera turnkey solutions on the market today take a black box solution approach, making it challenging for OEMs and Tier 1s to address changing market demands and slowing down development. With EagleCAM featuring R-Car SoCs, Renesas and LUPA introduce an open turnkey solution that delivers flexible, high-performance perception while shortening time to market and reducing the bill of materials (BOM) costs.

For further info, please access the link via: https://www.renesas.com/sg/en/about/press-room/renesas-and-lupa-accelerate-automotive-smart-camera-development-open-platform-turnkey-solutions

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2021.2.17  Renesas Develops Automotive SoC Functional Safety Technologies for CNN Accelerator Cores and ASIL D Control Combining World-Class Performance and Power Efficiency

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the development of processor technologies for automotive systems-on-chip (SoCs) used in applications such as advanced driver assistance systems (ADAS) and autonomous driving (AD) systems that aim to optimize both performance and power efficiency while supporting a high level of functional safety. Renesas’ successful development announced today includes: 1) A convolutional neural network (CNN) hardware accelerator core that delivers a world-class combination of deep learning performance of 60.4 trillion operations per second (TOPS) and a power efficiency of 13.8 TOPS/W; 2) sophisticated safety mechanisms for fast detection of and response to random hardware failures. This makes it possible to create a highly power efficient detection mechanism with a high failure detection rate; 3) A mechanism that allows software tasks with different safety levels to operate in parallel on the SoC without interfering with each other, thereby bolstering functional safety for ASIL D control. These technologies have been applied in the company’s latest R-Car V3U automotive SoC.

Applications such as next-generation ADAS and AD systems require outstanding deep learning performance of 60 TOPS or even 120 TOPS alongside power efficiency. In addition, since signal processing from object identification to the issuing of control instructions constitutes the bulk of the processing load in AD systems, achieving the functional safety equivalent to ASIL D – the strictest safety level defined in the ISO 26262 automotive safety standard – is a pressing issue. Renesas has developed new technologies to meet these needs, including a hardware accelerator that delivers outstanding CNN processing performance with superior power efficiency.

For further info, please access the link via: https://www.renesas.com/sg/en/about/press-room/renesas-develops-automotive-soc-functional-safety-technologies-cnn-accelerator-cores-and-asil-d

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2021.2.9  Renesas Updates Popular R-Car V3H with Improved Deep Learning Performance for Latest NCAP Requirements Including Driver and Occupant Monitoring Systems

Today, Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, introduced an update of its state-of the-art R-Car V3H system-on-chip (SoC) to deliver significantly improved deep learning performance for smart camera applications, including driver and occupant monitoring systems (DMS / OMS), automotive front cameras, surround view, and auto parking for high-volume vehicles up to Level 2+. The updated SoC combines sensor fusion on the real-time domain with up to ASIL C metrics and an architecture optimized for smart computer vision. It offers OEMs and Tier 1s a high-performance, low-power solution that supports the latest NCAP 2020 requirements as well as the roadmap to NCAP 2025 3 Stars at competitive system costs.

Building on the state-of-the-art recognition technology introduced with the R-Car V3H in February 2018, which includes integrated IP for convolutional neural networks (CNN), the updated R-Car V3H delivers four times the performance for CNN processing compared to the earlier version and achieves up to overall 7.2 TOPS processing including all computer vision IPs while maintaining low power consumption levels.

The highly integrated SoC supports up to ASIL C metrics safety goals on the real-time domain, reducing the need for an external safety microcontroller (MCU) to manage sensor fusion and final decision actions. The R-Car V3H features a suite of proven IPs that support the perception stack, sensor fusion with radar and/or Lidar, and ISP with up to eight MP cameras support, allowing OEMs and Tier 1s to achieve quicker time to market with lower bill of materials costs.

For further info, please access the link via: https://www.renesas.com/sg/en/about/press-room/renesas-updates-popular-r-car-v3h-improved-deep-learning-performance-latest-ncap-requirements

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2021.2.4  Renesas Expands Data Center Solutions Portfolio with Industry’s First CK440Q-Compliant Clock Generator for PCIe Gen5 and Beyond

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the availability of the low-jitter 9SQ440 clock generator IC designed for next-generation Intel platforms used in high-performance computing and data center applications. The latest in a long line of PCIe industry firsts from Renesas, the 9SQ440 is the industry’s first CK440Q-compliant server clock generator. Developed for the Intel CK440Q specification and future Intel® Xeon® processor requirements, the 9SQ440 provides customers a flexible, robust, and high-performance synthesizer to address PCIe Gen5 design challenges.

Customers can combine the newest member of Renesas’ comprehensive portfolio of data center solutions with the company’s broader lineup of PCIe timing solutions, including PCIe Gen5 clock buffers, and its portfolio of infrastructure power and smart power stage (SPS) devices to address their complete data center solution needs.

For further info, please access the link via: https://www.renesas.com/sg/en/about/press-room/renesas-expands-data-center-solutions-portfolio-industry-s-first-ck440q-compliant-clock-generator

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2021.2.3  Renesas Expands Low-Power Industrial and IoT Applications Reach With New RA4M2 MCU Group in Arm Cortex-Based MCU Family

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the expansion of its RA4 Series microcontrollers (MCUs) with 12 new RA4M2 Group MCUs. The new devices deliver an exceptional combination of very low power consumption, high performance, and enhanced security features that positions them as ideal solutions for industrial and IoT applications.

The highly power-efficient RA4M2 Group offer a market-leading operating current of only 80 µA/MHz in active mode, and low standby current of 0.7 mA. Even with these leading specifications, the new devices have an extremely fast wakeup time from standby of 30 µs. With operating frequencies up to 100 MHz, the RA4M2 MCUs are ideal for performance hungry, low power applications such as industrial and IoT edge devices.

The RA4M2 MCUs employ the Arm® Cortex®-M33 core based on Armv8-M architecture. They feature Arm TrustZone® technology and Renesas’ Secure Crypto Engine. The Secure Crypto Engine incorporates multiple symmetric and asymmetric cryptography accelerators, advanced key management, security lifecycle management, power analysis resistance, and tamper detection. This combination enables customers to realize secure element functionality, enabling safety and security in IoT edge devices for low-power applications.

For further info, please access the link via: https://www.renesas.com/sg/en/about/press-room/renesas-expands-low-power-industrial-and-iot-applications-reach-new-ra4m2-mcu-group-arm-cortex-based

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2021.1.28  Renesas Expands Inductive Position Sensing Portfolio to Automotive Motor Commutation with IPS2550 Sensor

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today launched its magnet-free IPS2550 inductive position sensor. Featuring improved performance and easy customization, as well as total stray field immunity, and reduced weight and form factor, the IPS2550 is ideal for use as an absolute position sensor for high-speed motor commutation in passenger cars, heavy-duty commercial and off-road vehicles as well as motorbikes. With its optimized bill-of-materials, the new sensor allows customers to cost effectively tailor sensor design for their applications and maximize the performance of the sensor’s accuracy.

Customers can also take advantage of a complete motor commutation solution for traction motors, electronic power steering, starter generators, and other motor applications when combining the new sensor with Renesas microcontrollers (MCUs), gate drivers, and motor drivers.

“We are excited with the response to the new inductive position sensing technology we introduced last June for industrial motors, and we look forward to bringing its advantages to automotive customers with the new IPS2550,” said Christian Wolf, Vice President, Automotive Sensor Business Division at Renesas. “The IPS2550 provides a slimmer and lighter contact-less sensor that continues to deliver the high performance and stability that automotive applications demand combined with the flexibility and ease of customization that enable businesses to manufacture their own resolver or magnetic sensor replacement cost effectively.”

Based on Renesas’ inductive position sensing technology, the magnet-free IPS2550 delivers speeds up to 600 krpm (electrical) and is designed around the motor, accommodating both off-axis (through shaft and side shaft) and on-axis positioning. Customers can match the number of sectors to pole pairs of the motor and cost-effectively boost accuracy compared with alternative sensing technologies. Featuring total stray field immunity, the thin and light sensor also enables easier motor integration and offers the standard materials required for customers to manufacture their own resolver replacement – reducing bill of materials costs. The IPS2550 has been developed according to ISO26262 to support, as a single IC, the most challenging functional safety critical applications, capable of supporting up to ASIL-C(D) system-level requirements.

For further info, please access the link via:https://www.renesas.com/sg/en/about/press-room/renesas-expands-inductive-position-sensing-portfolio-automotive-motor-commutation-ips2550-sensor

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2021.1.21  Renesas Collaborates with Microsoft to Accelerate Connected Vehicle Development

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced its collaboration with Microsoft to accelerate the development of connected vehicles. Renesas’ R-Car Starter Kit, based on Renesas’ R-Car automotive system-on-chip (SoC), is now available as a development environment for the Microsoft Connected Vehicle Platform (MCVP). MCVP combines a partner ecosystem with a horizontal platform of Azure cloud, AI and edge services on top of which mobility companies can build customer-facing solutions. Renesas has also been certified for Azure IoT Hub and Azure IoT Edge.

MCVP helps mobility companies accelerate the delivery of digital services across vehicle provisioning, two-way network connectivity, and continuous over-the-air updates of containerized functionality. Within the Renesas development environment, customers can utilize MCVP components and Renesas Board Support Package (BSP) in addition to multimedia package for R-Car. In addition, the R-Car Starter Kit is certified as an Azure IoT Edge device.

The Renesas development environment allows customers to develop software in the cloud or on a PC, and then install it on an R-Car SoC to perform verification before implementing it in applications for vehicles or embedded mobility devices. Identifying potential implementation issues early in the development of connected vehicles makes the design process more efficient. The collaboration with Microsoft will enable Renesas to advance the development of connected vehicles, stimulate the creation of Mobility as a Service (MaaS) businesses, and contribute to the establishment of on-demand businesses quickly.

For further info, please access the link via: https://www.renesas.com/sg/en/about/press-room/renesas-collaborates-microsoft-accelerate-connected-vehicle-development

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2021.1.21  Renesas Introduces Innovative New “Lab on the Cloud” Environment That Provides Instant Access to Popular Application Solutions

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced its new “Lab on the Cloud” environment where Renesas solutions, including popular evaluation boards, winning combinations and software, are hosted in a remote lab that customers can access and test online. The Lab on the Cloud is accessible at www.renesas.com/labonthecloud.

The Lab on the Cloud provides users with quick access to Renesas solutions before they receive a physical board or start a design. Boards are configured in a remote lab connected to the cloud and users access the boards through an intuitive GUI. Live video of each board allows users to test, monitor, and measure results instantly. The Lab on the Cloud environment utilizes a platform developed by Tenxer Technologies, and provides 24/7 access to, along with online support for, Renesas solutions.

For further info, please access the link via: https://www.renesas.com/sg/en/about/press-room/renesas-introduces-innovative-new-lab-cloud-environment-provides-instant-access-popular-application

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2021.1.20  Renesas Expands RF Portfolio to Cover Complete Signal Chain for Macro Base Stations

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today strengthened its industry-leading RF portfolio for traditional macro base transceiver stations (BTS) with four new high-reliability, high-performance devices, offering customers access to a complete RF signal chain solution. This expansion includes the industry’s first quad-channel F4482/1 TX variable gain amplifiers (VGA) and the F011x family of dual-channel first-stage low noise amplifiers (LNA). The new device set also includes the F1471 RF driver amplifier – the first high-power pre-driver with P1dB of over 1/2W – and the F2934 RF switch with higher isolation in a smaller package for digital predistortion (DPD) feedback path.

The expanded RF lineup delivers the high performance, high reliability, flexibility, and smaller form factor demanded by 5G Macro BTS systems. These new RF devices perform well across a wide range of environmental conditions and frequency bandwidths, and integrate Renesas’ Smart Silicon™ innovations, which enable smaller footprints for a given function – a key advantage for the large number of antenna paths required for each system.

“As the 5G transition picks up speed, we have upgraded our Macro BTS portfolio of receive and transmit chain components with higher performance and higher integration,” said Naveen Yanduru, Vice President of RF Communications, Industrial and Communications Business Division at Renesas. “We continue to bring new circuit design advancements to the market and are excited to introduce these new devices to address the complete RF signal chain and enable customers to be 5G ready as they bring their next-generation Macro BTS systems to market.”

Macro BTS customers can combine these new devices with the recently released F1490 high-gain RF amplifier and highly integrated F0443 RX VGA for complete RF signal chain solutions.

For further info, please access the link via: https://www.renesas.com/sg/en/about/press-room/renesas-expands-rf-portfolio-cover-complete-signal-chain-macro-base-stations

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