topics 2020
2020
Topics 2020
2020.12.17 Renesas Accelerates ADAS and Automated Driving Development with Best-in-Class R-Car V3U ASIL D System on Chip
Today, Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, unveiled the R-Car V3U – a best-in-class ASIL D system on chip (SoC) for advanced driver assistance systems (ADAS) and automated driving (AD) systems. Delivering a groundbreaking 60 TOPS with low power consumption for deep learning processing and up to 96,000 DMIPS, the R-Car V3U is built for the performance, safety, and scalability (up and down) demands of ADAS and AD architectures driving next-generation autonomous vehicles.
The new R-Car V3U is the first SoC using the R-Car Gen 4 architecture within the open and flexible Renesas autonomy platform for ADAS and AD. With the launch of R-Car V3U, the platform is now ready to offer complete scalability from entry-level NCAP applications up to highly automated driving systems.
“We are excited to introduce the newest generation of our popular R-Car SoCs for the next generation of ADAS and AD vehicles,” said Naoki Yoshida, Vice President, Automotive Digital Products Marketing Division at Renesas. “The R-Car V3U leverages assets developed on previous-generation devices, such as ADAS and Level 2 perception stack with the R-Car V3M and R-Car V3H, along with the Renesas autonomy platform, to offer a smooth migration path to single-chip Level 3 automated driving with short development turnaround and safe production launch.”
For further info, please access the link via: https://www.renesas.com/sg/en/about/press-room/renesas-accelerates-adas-and-automated-driving-development-best-class-r-car-v3u-asil-d-system-chip
pagetop2020.12.17 Renesas Expands ZMOD4410 Indoor Air Quality Family With Industry’s First IP67 Waterproof Sensor for High-Humidity Environments
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today expanded its popular ZMOD4410 Indoor Air Quality (IAQ) sensor platform with the industry’s first software-configurable IP67-qualified waterproof option for IAQ applications operating in wet or dirty environments such as kitchens, bathrooms, and hospital rooms, where they are frequently exposed to water, oils, and dust.
The firmware-configurable waterproof ZMOD4410 sensor features a unique hermetically sealed package that protects the sensor from water and dust with a hydrophobic and oleophobic material that is permeable to humidity and volatile organic compounds (VOCs) at the same time. By combining IP67-rated packaging with the industry-leading accuracy and reliability that the ZMOD4410 platform is known for, Renesas enables new, low-power IAQ applications that operate in splash zones, while maintaining the high precision and flexibility customers need to customize their systems and eliminating the need for expensive waterproofing systems.
For further info, please access the link via: https://www.renesas.com/sg/en/about/press-room/renesas-expands-zmod4410-indoor-air-quality-family-industry-s-first-ip67-waterproof-sensor-high
pagetop2020.12.16 Renesas and FAW Establish Joint Laboratory to Accelerate Development of Next-Generation Smart Vehicles for China’s Automotive Market
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, and China FAW Group Corporation (FAW), a leading automotive maker in China, announced the establishment of a joint laboratory in Changchun, China, effective December 1, 2020. The laboratory will enable FAW to build its development platform for intelligent driving and allow the two companies to jointly develop electronic control units (ECUs) for systems including autonomous driving, intelligent cockpit, powertrain and body control. The first set of new solutions developed in the joint laboratory will be applied to FAW’s flagship brand Hongqi.
FAW is committed to developing the next generation of intelligent and connected vehicles that meet needs for connectivity, automation, shared/social and electrification. To realize smart mobility, FAW strives to continuously improve its independent development capabilities by building its own intelligent driving development platform based on the high-performance automotive central computing unit. As the leading supplier of automotive processors, Renesas offers proven high-performance semiconductors as well as market-proven expertise for smart mobility. Based on Renesas automotive processors, including the RH850 Family of microcontrollers (MCUs), R-Car system-on-chips (SoCs), and power and analog devices, the companies will jointly develop a complete automotive controller development platform that meets the industry’s stringent functional safety and security standards required for FAW’s Hongqi vehicles.
For further info, please access the link via: https://www.renesas.com/sg/en/about/press-room/renesas-and-faw-establish-joint-laboratory-accelerate-development-next-generation-smart-vehicles
pagetop2020.12.10 Renesas Strengthens IP License Portfolio with IP Utilities to Facilitate Device Development
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced the release of IP Utilities – a new series of solutions aimed at simplifying the development of devices incorporating Renesas intellectual property (IP). The new IP Utilities include application packages and evaluation kits, as well as expanding Renesas’ growing portfolio of leading-edge IP licenses.
With the emergence of CPUs based on open-source architectures such as RISC-V, the use of licensed IP for device development is becoming more attractive from the cost, time and design risk perspectives. Developing original devices has become very demanding in terms of both the growing number of steps and the time required, due to the need to verify many IP component combinations, such as peripheral functions and application-specific functions. Leveraging Renesas’ extensive manufacturing expertise and the new IP Utilities solutions, developers can confidently shorten the development time for their original semiconductor devices based on Renesas’ highly reliable IP and reduce the time to market.
For further info, please access the link via: https://www.renesas.com/sg/en/about/press-room/renesas-strengthens-ip-license-portfolio-ip-utilities-facilitate-device-development
pagetop2020.12.9 Renesas Extends Arm Cortex-Based MCU Family with RA4M3 MCU Group for Industrial and IoT Applications
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today expanded its RA4 Series microcontrollers (MCUs) with the new 32-bit RA4M3 Group of MCUs. The RA4M3 MCUs boost operating performance up to 100 MHz using the Arm® Cortex®-M33 core based on Armv8-M architecture. Featuring industry-leading performance, Arm TrustZone® technology, Renesas’ Secure Crypto Engine, and a suite of new memory enhancements, the RA4M3 Group makes it easy to develop safe and secure IoT edge devices for low-power applications, such as security, metering, industrial, and HVAC applications.
The RA4M3 Group is designed for low-power IoT applications that require a balance of high performance, strong security, and higher memory. The RA4M3 MCUs combine TrustZone technology with Renesas’ enhanced Secure Crypto Engine, enabling customers to realize secure element functionality in a wide variety of IoT designs. The Secure Crypto Engine incorporates multiple symmetric and asymmetric cryptography accelerators, advanced key management, security lifecycle management, power analysis resistance, and tamper detection.
The RA4M3 MCUs drive power consumption down to 119uA/MHz in active mode running CoreMark from flash memory and 1.6mA in standby mode with standby wakeup times as fast as 30 µs – a critical element for IoT applications operating in the field for extended periods. For memory-intense applications, designers can combine Quad-SPI and SD-card interfaces with the MCUs’ built-in embedded memory to increase capacity. The background operation and Flash Bank SWAP option is ideal for memory optimized firmware updates running in the background. The increased embedded RAM with parity/ECC also makes the RA4M3 MCUs ideal for safety-critical applications. The RA4M3 MCUs also feature several integrated features to lower BOM costs, including capacitive touch sensing, embedded flash memory densities up to 1 MB, and analog, communications, and memory peripherals.
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2020.12.3 Renesas Highlights Optical Communications for Datacom and Telecom at the European Conference on Optical Communication 2020
TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, will showcase its portfolio of optical communication products at the virtual European Conference on Optical Communication (ECOC) 2020, which takes place December 7-9.
“Over the last several months, data center, network, and telecom infrastructures have navigated significant increases in the demands and requirements placed on their systems, driven by increasing volumes of high-bandwidth data such as live and on-demand streamed content, the deployment of more AI-based systems, and a worldwide shift to the cloud as more consumers depend on connected systems for their work and daily life,” said Diwakar Vishakhadatta, Vice President of Optical Communication Products at Renesas. “As cloud and networked services become a mission-critical factor in business’ and consumers’ daily lives, we have expanded our optical communications portfolio, adding elements of our leading microcontroller, timing, and power portfolios, to provide customers a one-stop mixed-signal IC solution with all of the elements they need to scale up for today’s systems and beyond.”
Customers can combine these optical communications series with a variety of Renesas microcontroller (MCU), power management, and timing devices for a solution that supplies all of the components customers need, from optical interconnect to MCU, making it easier and quicker to bring their telecom and data center systems applications to market.
For further info, please access the link via: https://www.renesas.com/sg/en/about/press-room/renesas-highlights-optical-communications-datacom-and-telecom-european-conference-optical
pagetop2020.12.2 Renesas RA Family Adds Ultra-Low Power RA2L1 MCU Group with Advanced Capacitive Touch Sensing for Cost-Effective, Energy-Efficient IoT Node HMI Applications
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the expansion of its 32-bit RA2 Series microcontrollers (MCUs) with 20 new RA2L1 Group MCUs, increasing the RA Family to 66 MCUs. The general-purpose RA2L1 MCUs use the Arm® Cortex®-M23 core operating up to 48 MHz. The RA2L1 MCUs are supported by the easy-to-use Flexible Software Package (FSP) and Renesas’ partner ecosystem, which offers software and hardware building block solutions that work out-of-the-box. The ultra-low power and innovative touch interface of the RA2L1 MCUs make them ideal for home appliance, industrial and building automation, medical and healthcare, and consumer human-machine-interface (HMI) IoT applications.
The RA2L1 MCUs are designed for ultra-low power consumption, with several integrated features to lower BOM costs, including capacitive touch sensing, embedded flash memory densities up to 256 KB, SRAM at 32 KB, analog, communications, and timing peripherals, and safety and security functions. In many battery-powered applications, the MCU spends most of the time in a low-power standby mode waiting for an internal or external event to wake-up the CPU and process data, make decisions and communicate with other system components. When benchmarked for power consumption, the RA2L1 MCU was certified with an EEMBC® ULPMark™ score of 304 at 1.8V, verifying its best-in-class power rating. Users can now minimize power consumption close to the standby levels to extend battery life.
The advanced capacitive touch IP in the RA2L1 MCUs provides enhanced operability for a variety of touch and touchless system implementations. For example, it supports sensing through acrylic or glass panels more than 10 mm thick, which is enough for use in household equipment with thick doors or partitions. It also implements proximity sensing (hovering) and 3D gestures. This accommodates hygiene or safety limitations. The RA2L1’s capacitive touch noise tolerance meets the requirements of IEC EN61000-4-3 level 4 (radiated) and EN61000-4-6 level 3 (conducted) to assure reliable operation with minimal sensing errors.
For further info, please access the link via: https://www.renesas.com/sg/en/about/press-room/renesas-ra-family-adds-ultra-low-power-ra2l1-mcu-group-advanced-capacitive-touch-sensing-cost
pagetop2020.12.1 Renesas’ Intersil Brand 14-Bit, 1-MSPS ADC Delivers Best-in-Class Radiation-Hardened Performance for Satellites, Manned Spacecraft, and Lunar Space Missions
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the industry’s highest performance single-chip 14-Bit, 1-MSPS successive-approximation-register (SAR) analog-to-digital converter (ADC) for radiation-hardened (rad-hard) space applications. Renesas’ Intersil brand ISL73141SEH delivers best in class dynamic and static performance, including signal-to-noise ratio (SNR), effective number of bits (ENOB), integral non-linearity (INL) and differential non-linearity (DNL). The ADC fully resets after every sample, clearing any errors that result from a single event upset (SEU) due to heavy ion radiation during spaceflight.
The ISL73141SEH is one of the key signal-path building blocks in long duration geosynchronous / geostationary Earth orbit (GEO) communication satellites and manned spacecraft, including lunar space missions. By delivering the industry’s best dynamic and static performance, the new 14-bit ADC accurately captures real-world analog transmissions and converts them for processing in the digital domain. The ISL73141SEH ADC is one of seven ICs, including rad-hard temperature sensor, multiplexer, quad op amp, ADC driver, LDO and voltage reference to form a complete sensor interface signal chain solution that accelerates telemetry, tracking, and control (TT&C) and flight computer system development.
“The ISL73141SEH offers satellite and spacecraft manufacturers the ultimate in ADC performance combined with a best-in-class sensor interface signal chain,” said Philip Chesley, Vice President, Industrial and Communications Business Division at Renesas. “Our space-grade 14-bit ADC delivers significantly better data converter performance than any other competing solution, and it is backed by six decades of leadership in radiation performance testing and characterization that gives spaceflight customers the mission assurance they demand.”
The space-grade ISL73141SEH is fully characterized for enhanced low dose rate-sensitivity (ELDRS) radiation performance up to 75krad(Si) for total ionizing dose (TID) and linear energy transfer (LET) up to 86MeV*cm2/mg for single event effects (SEE). The SEE testing also shows no single event latch-up (SEL) or single event burnout (SEB). In addition, single event transients (SETs) have also been mitigated by testing at an LET range up to 86MeV*cm2/mg.
For further info, please access the link via: https://www.renesas.com/sg/en/about/press-room/renesas-intersil-brand-14-bit-1-msps-adc-delivers-best-class-radiation-hardened-performance
pagetop2020.11.12 Renesas and Altran Team to Deploy First Social Distancing Wristwatch that uses Ultra-Wideband Chipset with Low Rate Pulse
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and Altran, the global leader in engineering and R&D services, and part of the Capgemini Group, today announced that they have co-developed a wearable solution for social distancing based on Ultra-Wideband (UWB) technology. Earlier this year, Renesas announced it had licensed UWB technology from 3db Access AG, a fabless semiconductor company specializing in secure UWB low power chips to augment Renesas microcontrollers (MCUs).
The platform’s form factor, a wristwatch, combines the Renesas Synergy™ S128 MCU featuring HMI capacitive touch with licensed secure ranging UWB technology. Unlike other social distancing wearables based on technologies such as Bluetooth® Low Energy (BLE), Renesas’ UWB chipset with Low Rate Pulse (LRP) can operate on 10X lower power consumption than competing UWB chips and measure distances with an accuracy of 10cm or less – the precision necessary for social distancing applications. The wristwatch’s safe distance is user-configurable; the wearer is alerted by LEDs and haptic feedback when a second device is detected within this range. Renesas will begin sampling the UWB chipset during the second half of 2021.
As co-developer and system integrator, Altran will leverage the UWB-based platform along with other internal assets to develop additional wearable solutions for social distancing as well as related location-based applications for clients across a broad range of markets. The social distancing wristwatch will be showcased in Altran’s innovation lab.
For further info, please access the link via:https://www.renesas.com/sg/en/about/press-room/renesas-and-altran-team-deploy-first-social-distancing-wristwatch-uses-ultra-wideband-chipset-low
pagetop2020.11.11 Renesas Introduces Scalable AI SMARC SoM Winning Combination Solution for Accelerating Time to Market of HMI and Embedded Vision Systems
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a scalable System-on-Module (SoM) Smart Mobility ARChitecture (SMARC) Winning Combination board solution comprised of 10 Renesas ICs, including microprocessor (MPU), power and analog ICs. The board solution speeds the development of artificial intelligence (AI) IoT face/object detection, image processing, and 4K video playback applications, including surveillance cameras, inspection equipment, and a range of industrial and building automation HMI and embedded vision systems.
The Renesas scalable SoM winning combo board is based on the SMARC 2.0 industry standard, which specifies an 82mm x 80mm form factor. The SMARC SoM board offers designers a choice of three different scalable versions of the Renesas 64-bit RZ/G2 MPU: a RZ/G2N dual core Arm® Cortex®-A57 MPU operating at 1.5 GHz for mid-range performance; the RZ/G2M MPU with dual-core Arm Cortex-A57 and quad-core Arm Cortex-A53 (1.2 GHz) for high performance; and the RZ/G2H MPU with quad-core Arm Cortex-A57 and quad-core Arm Cortex-A53 for ultra-high performance. All three MPUs (two cores up to eight cores) feature integrated 600 MHz PowerVR 3D graphics and a 4K UHD H.265 and H.264 codecs to satisfy the needs of different computer processing requirements.
The SMARC SoM winning combo board offers designers their choice of RZ/G2 MPU with up to 35.6K DMIPS performance, plus 2GB to 4GB LPDDR4 RAM memory, and 32GB eMMC. Each RZ/G2 MPU is capable of running edge video analytics and AI frameworks. The MPUs feature an integrated AI software library, comprehensive set of interfaces, error checking and correction (ECC) protection on both internal and external memories, Linux OS, and a Verified Linux Package (VLP) tested and maintained by Renesas. The solutions also feature Civil Infrastructure Platform (CIP) Super Long-Term Support (SLTS) kernel, and a Linux kernel bundled with a software development environment. Best of all, the SMARC SoM board provides an optimized power and programmable timing tree to assist the RZ/G2 MPU with a wide variety of applications.
For further info, please access the link via: https://www.renesas.com/sg/en/about/press-room/renesas-introduces-scalable-ai-smarc-som-winning-combination-solution-accelerating-time-market-hmi
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