topics 2018


2018

Topics 2018

2018.6.28  Renesas Electronics’ R-Car Virtualization Software Package Paves Way for Integrated Cockpit and Connected Car Devices with Hypervisor for R-Car System-on-Chip

TOKYO, Japan, June 28, 2018 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the “R-Car virtualization support package” that enables easier development of hypervisors for the R-Car automotive system-on-chip (SoC). The R-Car virtualization support package includes, at no charge, both the R-Car hypervisor development guide document and sample software for use as reference in such development for software vendors who develop the embedded hypervisors that are required for integrated cockpits and connected car applications. A hypervisor is a virtualization operating system (OS) that allows multiple guest OSs, such as Linux, Android™, and various real-time OSs (RTOS), to run completely independently on a single chip. Renesas announced the R-Car hypervisor in April of 2017 and the new R-Car virtualization Support Package was developed to help software vendors accelerate their development of R-Car hypervisors.

For full article, please view link as : https://www.renesas.com/en-hq/about/press-center/news/2018/news20180628.html

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2018.6.14  Renesas Electronics Updates Model-Based Development Environment to Significantly Ease Software Development Burdens for Multicore Automotive Control Microcontrollers

TOKYO, Japan, June 14, 2018 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced an update to its “Embedded Target for RH850 Multicore” model-based development environment for multicore microcontrollers (MCUs) for automotive control applications. The update supports development of systems with multirate control (multiple control periods), which is now common in systems such as engine and body control systems. This model-based development environment has become practical even in software development scenarios for multicore MCUs, and can reduce the increasingly complex software development burdens especially in control system development of self-driving cars.

For further info, please access link via : https://www.renesas.com/en-hq/about/press-center/news/2018/news20180614.html

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2018.6.1  Renesas Electronics Announces Closure of Yamaguchi Factory and Partial Consolidation of Shiga Factory (Silicon Production Line)

TOKYO, Japan, June 1, 2018― Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, today announced its policy to close and consolidate in approximately two to three years the Yamaguchi Factory (Ube, Yamaguchi Prefecture) and a portion (the silicon production line) of the Shiga Factory (Otsu, Shiga Prefecture), respectively, of its wholly owned subsidiary Renesas Semiconductor Manufacturing Co., Ltd. (“Renesas Semiconductor Manufacturing”). The products currently manufactured on the production lines affected by this decision are scheduled to either be discontinued or to have production transferred to other facilities operated by the Renesas Group.

For full article, please view link via : https://www.renesas.com/en-hq/about/press-center/news/2018/news20180601.html

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2018.5.17  Renesas and Magna Bring Advanced Safety Features to More Vehicle Segments and Consumers

TOKYO, Japan, AURORA, Canada, May 17, 2018 ―Renesas Electronics Corporation (TSE: 6723), an industry-leading supplier of automotive semiconductor solutions, and Magna, a mobility technology company and one of the world’s largest automotive suppliers, aim to accelerate the mass adoption of advanced driving assistance system (ADAS) features with a new cost-efficient 3D surround view system designed for entry- and mid-range vehicles. The 3D surround view system adopts Renesas’ high-performance, low-power system-on-chip (SoC) optimized for smart camera and surround view systems. By enabling 3D surround view safety capabilities, the new system helps automakers to deliver safer and more advanced vehicles to a larger number of car consumers, contributing to a safer vehicle society.

For full article, please access link via : https://www.renesas.com/en-hq/about/press-center/news/2018/news20180517.html

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2018.5.11  Renesas Electronics Reports First Quarter 2018 Financial Results

TOKYO, Japan, May 11, 2018 ― Renesas Electronics Corporation (TSE:6723, “Renesas”), a premier supplier of advanced semiconductor solutions, today reported financial results for the first quarter ended March 31, 2018 (January 1, 2018 to March 31, 2018).

For further info, please view link via https://www.renesas.com/en-hq/about/press-center/news/2018/news20180511a.html

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2018.4.25  Renesas Electronics Introduces ISL91302B, ISL91301A, and ISL91301B Multiphase PMICs with Highest Efficiency and Smallest Footprint

TOKYO, Japan, April 25, 2018 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced three programmable power management ICs (PMICs) that offer the highest power efficiency and smallest footprint for application processors in smartphones and tablets: the ISL91302B, ISL91301A, and ISL91301B PMICs. The PMICs also deliver power to artificial intelligence (AI) processors, FPGAs, and industrial microprocessors (MPUs), and they are ideal for powering the supply rails in solid-state drives (SSDs), optical transceivers, and a wide range of consumer, industrial and networking devices. The ISL91302B dual/single output, multiphase PMIC provides up to 20A of output current and 94 percent peak efficiency in a 70mm2 solution size that is more than 40 percent smaller than competitive PMICs (Note).

For full article, please access link via : https://www.renesas.com/en-hq/about/press-center/news/2018/news20180425.html

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2018.4.19  Renesas Electronics Delivers Blood Pressure Monitoring Evaluation Kit for Immediate Evaluation

TOKYO, Japan, April 19, 2018 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced an expansion of its healthcare solution lineup with the launch of a new blood pressure monitoring evaluation kit. The new blood pressure monitoring evaluation kit comprises hardware and software elements needed to jump start blood pressure measurement design. The kit includes a pressure sensor, arm cuff, pump, electronically controlled valve, LCD panel, and a reference board that incorporates an RL78 Microcontroller(MCU)-based ASSP (application specific standard product) that includes analog functions required for blood pressure measurement. Reference software and graphical user interface (GUI) development tool are also part of the new evaluation kit. Using the new evaluation kit, system manufacturers can immediately begin their system evaluations and significantly reduce their development time.

For full article, please access link via : https://www.renesas.com/en-hq/about/press-center/news/2018/news20180419.html

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2018.3.27  Renesas Electronics Unveils World’s First On-Chip Flash Memory Microcontroller Featuring Advanced 28nm Embedded Flash Technology

TOKYO, Japan, March 27, 2018 ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the sample shipment of the industry’s first on-chip flash memory microcontroller (MCU) using a 28 nanometer (nm) process technology. To contribute to the realization of next-generation green cars and autonomous vehicles with higher efficiency and higher reliability, the revolutionary RH850/E2x Series MCU incorporates up to six 400 megahertz (MHz) CPU cores, which makes it the first on-chip flash memory automotive MCU to achieve the industry’s highest processing performance (Note 1) of 9600 MIPS (Note 2). The new MCU series also features a built-in flash memory of up to 16 megabytes (MB) as well as enhanced security functions and functional safety.

For further info, please access link via :https://www.renesas.com/en-hq/about/press-center/news/2018/news20180327.html

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2018.3.21  Renesas Electronics Showcases Latest IoT Solutions Enabling Smart City at IoT ASIA 2018

SINGAPORE, March 21, 2018 -Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, will showcase a variety of IoT solutions and expertise at IoT ASIA 2018, to be held at Singapore Expo Hall 3 on March 21-22, in Singapore. Demonstrations in booth #D05 will highlight the company’s high-performance and cost-efficient solutions designed to enable a smart city. These include the Renesas Synergy™ Enterprise Cloud Toolbox with AE-CLOUD1 Kit, the RX65N Envision kit for HMI applications, and a DC-PLC networking demonstration based on the powerline communication modem solution for building automation

For further info, please access link via : https://www.renesas.com/en-hq/about/press-center/news/2018/news20180321.html

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2018.3.15  Renesas Electronics Announces the Winners of its Fourth European MCU Car Rally Held at embedded world 2018 in Nuremberg

Düsseldorf, Germany, March 15, 2018 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the winners of its annual MCU Car Rally competition for university students, which was held on March 1, 2018 at embedded world 2018 in Nuremberg, Germany. Twenty-eight teams from 16 universities all over Europe, comprising approximately 150 students and their professors, participated in the challenge by each developing a functioning model rally car that includes sensors to detect a white line on the track and an RX microcontroller (MCU) from Renesas to provide system, motor and sensor control. The lap times were recorded by a timing system developed using the Renesas Synergy™ Platform.

For further info, please access the link below :
https://www.renesas.com/en-hq/about/press-center/news/2018/news20180315.html

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