topics 2017


2017

Topics 2017

2017.12.5  Renesas Electronics and HELLA Aglaia Open Up the Front Camera Market with Open, Scalable ADAS Solution

TOKYO, Japan and Berlin, Germany, December 5, 2017 — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, and HELLA Aglaia, one of the leading global developers of intelligent visual sensor systems, today announced their open and scalable front camera solution for advanced driver assistance systems (ADAS) and automated driving. The new front camera solution combines the R-Car V3M, Renesas’ high-performance, low-power image recognition system-on-chip (SoC) for New Car Assessment Program (NCAP, Note 1), and HELLA Aglaia´s field-proven camera software designed to meet level 2 (partial automation) and level 3 (conditional automation) of the SAE International’s new J3016 standard (Note 2). Designed for scalability, the solution enables system designers to build a wide range of front cameras from cameras supporting NCAP to cameras supporting requirements for up to level 3 applications.
For more detail, please access the link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171205.html

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2017.11.30  Mahindra & Renesas Launch Formula E Technical Partnership

Hong Kong, November 30, 2017 ― Mahindra & Mahindra, Ltd. a pioneer in the development of electric vehicles, and Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the formation of a strategic partnership with Renesas as the official technology partner of the Mahindra Racing Formula E team.
For more detail, please access the link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171130.html

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2017.11.29  Renesas Electronics Accelerates Industrial Ethernet Application Development with New RZ/N1 Solution Kit

TOKYO, Japan, November 29, 2017 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the availability of the new RZ/N1 microprocessor (MPU) Solution Kit designed to support various industrial network applications including programmable logic controllers (PLCs), intelligent network switches, gateways, operator terminals and remote I/O solutions.
For more detail, please access the link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171129.html

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2017.11.7  Renesas Electronics supports HIPERFACE DSL® Digital Encoder Interface with RZ/T1 Solution

TOKYO, Japan, November 7, 2017 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced a new solution package for its RZ/T1 Group of microprocessors (MPUs) supporting HIPERFACE DSL® digital encoder interface for AC servo applications. The support of HIPERFACE DSL for RZ/T1 reduces the customer’s system bill-of-materials (BOM) cost and enables faster time-to-market.
For further info, please assess the link below :
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171107.html

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2017.11.2  Renesas Electronics Reports Third Quarter 2017 Financial Results

TOKYO, Japan, November 2, 2017 ― Renesas Electronics Corporation (TSE:6723, “Renesas”), a premier supplier of advanced semiconductor solutions, today reported financial results for the third quarter ended September 30, 2017.

“We have been continuously improving our gross and operating margins by pursuing sales growth and cost efficiency”, said Bunsei Kure, President and CEO, Renesas Electronics Corporation. “Our third quarter non-GAAP semiconductor sales increased by 29.6% year on year, driven by increased sales mainly in the automotive and industrial businesses, and the dissipation of the impact from the Kumamoto earthquake that occurred in the same period a year ago, in addition to the integration of Intersil. We expect to achieve traction in semiconductor sales and gross margin during the coming quarter on a year-on-year basis.”
For further info, please assess the link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171102a.html

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2017.10.31  Renesas, Toyota, and Denso Bring Autonomous-Driving Vehicles to Market Faster

TOKYO, Japan, October 31, 2017 — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that its automotive technologies will drive Toyota Motor Corporation’s (TSE: 7203) autonomous vehicles, which are presently under development and scheduled for commercial launch in 2020. Selected by Toyota and Denso Corporation (TSE: 6902), Renesas’ autonomous-driving vehicle solution for Toyota’s autonomous vehicles combines the R-Car system-on-chip (SoC), which serves as an electronic brain for in-vehicle infotainment and advanced driver-assistance systems (ADAS), and the RH850 microcontroller (MCU) for automotive control. This combination delivers a comprehensive semiconductor solution that covers peripheral recognition, driving judgements, and body control.
For further info, please assess the link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171031c.html

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2017.10.31  Renesas Electronics Expands 3D Graphics Cluster Market to Entry-Class Cars with R-Car D3 System-on-Chip

TOKYO, Japan, October 31, 2017 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced its high-performance R-Car D3 automotive infotainment system system-on-chip (SoC), designed to expand the use of 3D graphics instrument clusters (3D clusters) that support 3D graphics displays in entry-class cars. The R-Car D3 achieves both high-performance graphic capabilities and contributes to significant reduction in overall system development cost.
For further info, please assess the link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171031a.html

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2017.10.26  Renesas Electronics Employee Receives IEC 1906 Award from International Electrotechnical Commission

TOKYO, Japan, October 26, 2017 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that Naoshi Doi, Principal Engineer, Shared R&D Division 2, Broad-based Solution Business Unit, received the IEC 1906 Award from the International Electrotechnical Commission (IEC).
For further info, please assess the link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171026.html

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2017.10.19  Renesas Electronics Unveils Integrated Software Development Environment for ADAS and Automated Driving

TOKYO, Japan, October 19, 2017 – Renesas Electronics Corporation (TSE: 6723, Renesas), a premier supplier of advanced semiconductor solutions, today announced that the Renesas e2 studio integrated software development environment now has been expanded with new features to support the R-Car V3M system-on-chip (SoC) for in-vehicle infotainment and advanced driving assistance systems (ADAS). e2 studio is an integrated development environment (IDE) based on the open-source Eclipse C/C++ Development Tooling (CDT) software and already supports other Renesas devices including the RZ/G Family and the Renesas Synergy™ microcontrollers (MCUs). Expanded to support the R-Car V3M, the e2 studio can now be used as a core tool for automotive SoC software development. The e2 studio-based R-Car V3M solution is part of Renesas autonomy™, which was announced in April 2017
For more detail, please view the link below :
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171019.html

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2017.10.5  Renesas Delivers R-Car Reference Package for Android Supporting Android™ 8.0

TOKYO, Japan, October 5, 2017 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the availability of the R-Car reference package for Android™ for Renesas R-Car automotive system-on-chips (SoCs). This package supports Android 8.0, the latest OS announced by Google on August 22, 2017.
For more detail, please visit link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171005.html

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