topics 2017


2017

Topics 2017

2017.10.5  Renesas Delivers R-Car Reference Package for Android Supporting Android™ 8.0

TOKYO, Japan, October 5, 2017 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the availability of the R-Car reference package for Android™ for Renesas R-Car automotive system-on-chips (SoCs). This package supports Android 8.0, the latest OS announced by Google on August 22, 2017.
For more detail, please visit link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20171005.html

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2017.9.25  Renesas Electronics Named Hardware Innovation Winner at AutoSens Awards 2017 for Most Innovative Development in ADAS and Automated Driving

TOKYO, Japan, September 25, 2017 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that it has been honored with the AutoSens Awards 2017 in the hardware innovation category for its innovative development in advanced driving assistance systems (ADAS) and automated driving. The award ceremony was held during AutoSens on September 20 at the Atomium in Brussels, Belgium. The AutoSens Award acknowledges the greatest design, technical and marketing innovations within the automotive imaging sector. Among the AutoSens Awards, the Hardware Innovation Award recognizes a recent hardware product, technical team or company that has contributed most to the technical development of vehicle perception.
For detail, please visit the link below:
https://www.renesas.com/en-hq/about/press-center/news/2017/news20170925.html

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2017.9.14  Renesas Electronics and Cogent Embedded Collaborate to Make 3D Surround View Parking Assist System Standard in All New Cars

TOKYO, Japan, SAN JOSE, CALIF. September 14, 2017 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and Cogent Embedded Inc., a leading embedded software provider to the automotive industry, today announced their joint development of a 3D surround view solution to assist drivers during parking or low speed maneuvers. Designed for parking assist systems in entry- and mid-level cars, the new solution combines the Renesas R-Car V3M system-on-chip (SoC), which incorporates a dedicated image rendering unit (IMR) that delivers realistic 360-degree surround view, with Cogent’s customizable software on a reference board. The solution eliminates the need to use a GPU, thereby enabling system developers to create power-efficient 3D surround view parking assist systems at low cost. On-demand customization services can also be provided by Cogent Embedded to enable system developers to concentrate on developing application software to differentiate their systems.
For detail, please assess link below :
https://www.renesas.com/en-hq/about/press-center/news/2017/news20170914.html

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2017.9.7  Renesas Electronics High-Performance Automotive Chips Adopted by Nissan for its New LEAF Automated-Parking System

TOKYO, Japan, September 7, 2017 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions today announced that its R-Car system-on-chip (SoC) for car infotainment and advanced driving assistant systems (ADAS) as well as its RH850 automotive control microcontroller (MCU) have been adopted by Nissan for the ProPILOT Park, a full-fledged automated-parking system, of its new LEAF, Nissan’s new 100 percent electric vehicle which debuted on September 6, 2017.
For detail, please access the link : https://www.renesas.com/en-hq/about/press-center/news/2017/news20170907.html

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2017.7.18  Renesas Electronics Wins Patent Infringement Lawsuit Filed by Zond LLC

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, today announced that on July 14, 2017 EDT, the United States District Court for the District of Massachusetts (Boston), ruled in favor of Renesas Electronics Corporation and Renesas Electronics America Inc., a wholly-owned subsidiary of Renesas, in a patent infringement lawsuit brought against it by Zond, LLC (based in Massachusetts) filed on July 8, 2013.

For more detail, please visit this url: https://www.renesas.com/en-hq/about/press-center/news/2017/news20170718.html

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2017.6.8  Renesas Electronics Achieves Industry’s Lowest Standby Power of 13.7 nW/Mbit and 1.84 ns High-Speed Readout with New Embedded SRAM that Implements New Circuit Technology with SOTB Structure

Prototyped Low-Power Embedded SRAM Enables Battery-Free Operation and Extended Battery Lifetimes for IoT, Home Electronics, and Healthcare Applications

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the successful development of a new low-power SRAM circuit technology that can be embedded in application specific standard products (ASSPs) for Internet of Things (IoT), home electronics, and healthcare applications. The new technology provides a function for switching dynamically with low power overhead between active operation in which the CPU core performs read and write operations of the embedded SRAM, and the standby mode in which the stored data is retained.

Detail available at https://www.renesas.com/en-hq/about/press-center/news/2017/news20170608.html

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2017.5.30  Renesas Electronics Delivers R9J02G012 Controller That Enables Device-to-Device Authentication in Support of Safer USB Power Delivery Ecosystem

Industry’s First USB Power Delivery Controller Supporting Both USB PD Rev. 3.0 and USB Type-C™ Authentication Rev 1.0 in a Single Package

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced its new R9J02G012 USB Power Delivery (USB PD) controller intended for use in a wide range of USB PD products employing direct current (DC) power including AC adapters, PCs, smartphones, other consumer and office equipment, and toys. The R9J02G012 is the industry’s first single package solution (Note 1) that supports both USB Power Delivery Rev. 3.0 (USB PD 3.0) and USB Type-C™ Authentication Rev 1.0, which enables device-to-device authentication.

Detail available at https://www.renesas.com/en-hq/about/press-center/news/2017/news20170530.html

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2017.5.25  Renesas Electronics and Great Wall Motors Announce Strategic Collaboration on Development of New Energy Vehicles and Self-Driving Cars

Renesas Electronics Corporation (TSE:6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Great Wall Motors Co. Ltd. (“GWM”), China’s largest SUV and pickup manufacturer, today announced a strategic collaboration to develop automotive semiconductor technologies and solutions that will spur the growth of advanced new energy vehicles, including electric vehicles (EV) and plug-in hybrid vehicles (PHV), and self-driving cars in China.

The signing ceremony of the strategic collaboration was held in Baoding, Hebei with attendance of Bunsei Kure, President and CEO of Renesas Electronics Corporation, and Wei Jianjun, Chairman of Great Wall Motors, and other representatives of both companies.

Detail available at https://www.renesas.com/en-hq/about/press-center/news/2017/news20170525.html

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2017.5.24  Renesas R-Car Starter Kit Adopted as a Standard Reference Platform for Automotive Grade Linux to Accelerate IVI Development for Next-Generation Connected Cars

R-Car Starter Kit Supports the Latest Unified Code Base 3.0 64-Bit Software Environment

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that Automotive Grade Linux (AGL) has adopted the Renesas R-Car Starter Kit as one of its standard reference platforms for software development. AGL is a collaborative open source project that is bringing together automakers, suppliers and technology companies to build a Linux-based, open software platform for automotive applications that can serve as the de facto industry standard. Its adoption of the Renesas R-Car Starter Kit makes it easy for software developers to acquire the hardware environment that runs software developed by this project and allows them to quickly and easily develop in-vehicle infotainment (IVI) application software for next-generation connected cars.

Detail available at https://www.renesas.com/en-hq/about/press-center/news/2017/news20170524.html

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2017.5.12  Renesas Electronics Announces Absorption-Type Merger (Simplified/Short-Form Merger) with Consolidated Subsidiary

Renesas Electronics Corporation (TSE: 6723, “Renesas Electronics”), a premier provider of advanced semiconductor solutions, today announced that, following the approval of Renesas Electronics’ Board of Directors on May 12, 2017, it will consolidate its subsidiary Renesas System Design, Co., Ltd. (“Renesas System Design”) through an absorption-type merger (“Merger”).

Certain disclosure items and details have been omitted due to the Merger being an absorption-type merger of a wholly-owned subsidiary.

Detail available at https://www.renesas.com/en-hq/about/press-center/news/2017/news20170512c.html

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